Semiconductor refrigeration temperature control box

Abstract

The invention relates to a semiconductor refrigeration temperature control box. Semiconductor refrigeration chips are symmetrically embedded in the side inner wall of a shell; first water cooling heads are arranged at hot ends of the semiconductor refrigeration chips; the water cooling heads are connected with water pumps through water pipes; the other ends of the water pumps are connected with water inlets of circulating water tanks through water pipes; water outlets of the circulating water tanks are connected with air cooling radiators through water pipes; the other ends of the air cooling radiators are connected to second water cooling heads arranged on the semiconductor refrigeration chips through water pipes to form a circulating loop; a temperature sensor is arranged in the shell, and is connected with a microprocessor; the microprocessor is connected with a temperature control module; and the temperature control module is connected with the semiconductor refrigeration chips. The semiconductor refrigeration temperature control box needs no refrigerant, is environment-friendly, free of pollution, small in size, low in weight, low in heat inertia and fast in refrigeration, can normally work no matter in an overweight or weightlessness state and in a horizontal or vertical state or in any angle with the ground, and satisfies the demands of limited space in spaceflight, medical treatment and vehicle carrying.

Description

technical field [0001] The invention relates to the field of portable intelligent temperature control, in particular to a semiconductor refrigeration temperature control box. Background technique [0002] With the continuous development of microelectronics technology, miniaturization or even miniaturization has become the development trend and direction of various equipment. For the unique requirements of special and limited spaces such as aerospace, military, medical, biological products, and vehicles, it is often necessary to store small or even trace amounts of materials precisely. Therefore, the semiconductor refrigeration temperature control box came into being. [0003] The existing temperature control box is mainly refrigerated by compressor and refrigerant. Freon refrigerant destroys the ozone layer and the compressor is bulky, and the placement position must be stable to ensure the normal operation of the temperature control box. Even if new refrigerants are gradu...

AI Technical Summary

Problems solved by technology

The existence of the compressor makes the volume of the temperature control box limited and the noise is loud. Therefore, the existing temperature control box has special requirements for the volume and working environment, which is not convenient for precise and flexible control of a small amount of materials, and is not satisfied with working in a limited space. needs

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