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Electrostatic chuck having properties for optimal thin film deposition or etch processes

A volume resistivity and electrode technology, applied in the field of electrostatic chucks, can solve the problems of increasing the cost of manufacturing integrated circuits and affecting performance, etc.

Inactive Publication Date: 2017-12-12
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This non-uniformity can significantly affect performance and increase the cost of manufacturing integrated circuits

Method used

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  • Electrostatic chuck having properties for optimal thin film deposition or etch processes
  • Electrostatic chuck having properties for optimal thin film deposition or etch processes

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Embodiment Construction

[0015] Embodiments of the present disclosure provide an electrostatic chuck that may be used in a processing chamber for any number of substrate processing techniques. Electrostatic chucks are particularly useful for performing plasma-assisted dry etch processes that require both heating and cooling of the substrate surface without breaking vacuum. Additionally, electrostatic chucks may be useful for performing thin film deposition processes on substrates. Electrostatic chucks as described herein can be used in etch chambers from Applied Materials, Inc. of Santa Clara, California, but are also applicable to chambers for other plasma processes chambers as well as chambers from other manufacturers.

[0016] figure 1 is a partial cross-sectional view illustrating an exemplary processing chamber 100 . The processing chamber 100 may be used in an etching process or a deposition process. In one embodiment, the processing chamber 100 includes a chamber body 105 , a gas distribut...

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Abstract

A heated support assembly is disclosed which includes a body comprising aluminum nitride doped with magnesium oxide having a volume resistivity of about 1 X 1010 Omega-cm at about 600 degrees Celsius, an electrode embedded in the body, and a heater mesh embedded in the body.

Description

technical field [0001] Embodiments of the present disclosure generally relate to electrostatic chucks having physical properties and designs that enhance uniformity in thin film deposition and / or uniformity in etch processes. Background technique [0002] Integrated circuits have grown into complex elements that can include millions of components (eg, transistors, capacitors, resistors, etc.) on a single chip. Advances in chip design require faster circuits and greater circuit density, and the demand for greater circuit density has necessitated a reduction in the size of integrated circuit components. The minimum dimensions of the features of such elements are known in the art as critical dimensions. Critical dimensions generally include minimum widths of features of circuit structures such as lines, spaces between lines, columns, openings, and the like. [0003] As these critical dimensions shrink, process uniformity across the substrate becomes important in order to main...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683C04B35/581C04B35/622
CPCC04B35/581C04B35/622H01L21/6831H01L21/6833H01L2221/683C04B2235/3225C04B2235/3222C04B2235/80C04B2235/656H01L21/67103H01L21/67126
Inventor 林兴A·A·哈贾E·P·哈蒙德四世J·C·罗查-阿尔瓦雷斯C·A·拉玛林格姆G·巴拉苏布拉马尼恩段仁官周建华J·J·斯特拉列
Owner APPLIED MATERIALS INC