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High-performance water-cooling heat dissipation platform for mainframe

A water-cooled heat dissipation, high-performance technology, applied in energy-saving computing, climate sustainability, instruments, etc., can solve problems such as high noise and high energy consumption, and achieve the effect of improving efficiency

Inactive Publication Date: 2017-12-29
翟一策
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a high-performance mainframe water-cooled heat dissipation platform, which fully contacts the air in the mainframe box with water for heat exchange, thereby discharging the heat in the mainframe box, achieving good heat dissipation and improving the traditional heat dissipation The defects of high noise and high energy consumption

Method used

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  • High-performance water-cooling heat dissipation platform for mainframe
  • High-performance water-cooling heat dissipation platform for mainframe
  • High-performance water-cooling heat dissipation platform for mainframe

Examples

Experimental program
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Effect test

Embodiment 1

[0040] Such as figure 1 As shown: the present invention provides a high-performance mainframe water-cooled heat dissipation platform, including a sealed mainframe box 1, the top of the mainframe box 1 is provided with an air inlet 2, the bottom of the mainframe box 1 is provided with an air outlet hole 3, and the inlet The air hole 2 is communicated with the air inlet pipe 5, the air outlet hole 3 is communicated with the air outlet pipe 6, the air inlet pipe 5 is communicated with the upper end of the water-cooled cooling mechanism, and the air outlet pipeline 6 is communicated with the lower part of the water-cooled cooling mechanism. A drying mechanism 4 is arranged in the intake pipe 5 .

[0041] The water cooling mechanism includes a vertical cooling pipeline 11, the upper end of the cooling pipeline 11 is provided with an air collecting chamber 7, the lower end of the cooling pipeline 11 is provided with a water storage tank 16, and the bottom of the water storage tank 1...

Embodiment 2

[0050] Such as figure 2 and image 3 As shown, the difference between this embodiment and Embodiment 1 is:

[0051] A cooling fan 23 is arranged corresponding to the lifting duct 9 , and a heat conduction plate 27 is vertically arranged outside the lifting duct 9 .

[0052] In order to cope with the host with more serious heat generation, a cooling fan is installed corresponding to the lifting pipe, and a heat conducting plate is vertically arranged outside the lifting pipe. The cooling fan blows air on the lifting pipe, which can cool down the cooling water faster. The heat conduction plate connects the lifting pipes on the upper and lower floors, increasing the contact surface between the lifting pipe and the wind blown by the cooling fan, which can be taken away by the fan within a unit time more heat.

Embodiment 3

[0054] Such as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is:

[0055] The air bubble crushing mechanism 10 includes a cross-shaped bracket 21 arranged in the cooling pipe 11, an installation hole is arranged in the middle of the bracket 21, a bearing 20 is arranged in the installation hole, and a rotating rod 19 is arranged in the bearing 20. A plurality of stirring rods 18 are evenly arranged on the upper end of the rotating rod 19 , and an underwater motor 22 is arranged below the cross-shaped support 21 , and the underwater motor 22 is connected to the lower end of the rotating rod 19 through transmission.

[0056] The stirring rod 18 is a cylindrical structure, and several thorns 17 are arranged on the stirring rod 18, and the thorns 17 are cylindrical structures.

[0057] There are at least eight stirring rods 18, the diameter of the stirring rods 18 is less than one centimeter, and the diameter of the thorns 17 is less than three millim...

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Abstract

The invention discloses a high-performance water-cooling heat dissipation platform for a mainframe. The platform includes a sealed mainframe box, the top of the mainframe box is provided with an air inlet hole, the bottom of the mainframe box is provided with a venting hole, the air inlet hole is communicated with an air inlet pipeline, the venting hole is communicated with a venting pipeline, the air inlet pipeline is communicated with the upper end of a water cooling mechanism, the venting pipeline is communicated with the lower portion of the water cooling mechanism, and the air inlet pipeline is internally provided with a drying mechanism. According to the high-performance water-cooling heat dissipation platform, air inside the mainframe box is fully in contact with water to conduct heat transfer, and therefore heat in the mainframe box is exhausted, a heat dissipation effect is well achieved, and meanwhile, the defects of loud noise and big energy consumption in a traditional heat dissipation mode can be overcome; the platform is simple in overall structure, low in manufacturing cost and easy to popularize.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of a computer mainframe, in particular to a high-performance mainframe water-cooling heat dissipation platform. Background technique [0002] At present, the host cooling system of computers generally adopts driving fans or liquid cooling technology to cool down the related heating components, but there are certain technical defects: 1. Defects of air cooling technology: 1. During the cooling process of the fan, the computer host The power supply and related lines will increase the load and generate secondary heat. 2. The fan itself increases power consumption and increases the power load, which is not energy-saving and environmentally friendly. 3. The fan generates static electricity when it rubs against the air and the dust in the air, and absorbs the dust particles. After a long time of operation, it will cause dirt accumulation and reduce the heat dissipation effect. In addition, it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20Y02D10/00
Inventor 翟一策
Owner 翟一策
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