Method for determining rationality of thermal cycling test condition cutting of spacecraft electronic equipment

A technology of electronic equipment and test conditions, applied in the fields of electrical digital data processing, instruments, special data processing applications, etc., can solve the problems of under-testing or over-testing of a single spacecraft, and the tailoring formula cannot cover the types of spacecraft subsystems, etc. Avoid the effects of over-testing and under-testing

Active Publication Date: 2018-01-05
BEIJING INST OF SPACECRAFT ENVIRONMENT ENG
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a tailoring method for the thermal cycle test conditions of a spacecraft electronic stand-alone, to determine reasonable thermal cycle test conditions, and solve the problem that the thermal cycle test condition tailoring formula in the MIL1540 standard and GB1027 cannot cover all types of spacecraft failure types And all types of subsystems, resulting in the problem of under-testing or over-testing of part of the spacecraft

Method used

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  • Method for determining rationality of thermal cycling test condition cutting of spacecraft electronic equipment
  • Method for determining rationality of thermal cycling test condition cutting of spacecraft electronic equipment
  • Method for determining rationality of thermal cycling test condition cutting of spacecraft electronic equipment

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Embodiment 1: applied to thermal control subsystem TCS

[0054] according to figure 1 The specific steps of the method are as follows:

[0055] Step 1: Determine the total number of failure types of the subsystem m = 5, including five types of failures: solder joint failure, coating failure, component failure, wire failure, and circuit board thermal deformation.

[0056] Step 2: According to the historical fault distribution statistics of spacecraft subsystems, determine the fault weight coefficient a of TCS i , the values ​​are shown in Table 3.

[0057] Table 3 Weight coefficients of thermal failure types of TTC subsystems

[0058] weight factor

a 1

a 2

a 3

a 4

a 5

Fault type

Solder joint failure

coating failure

Component failure

wire fault

Thermal deformation of the circuit board

value

0.5

0.12

0.04

0.2

0.14

[0059] Step 3: Count the material types of TCS electronic equipment, and...

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Abstract

The invention discloses a thermal cycling test condition cutting method suitable for different spacecraft electronic equipment. Based on the statistical law of historical fault distribution and thermal fatigue faults of a subsystem and a single-machine stage of an spacecraft, a comprehensive fatigue acceleration index is obtained by using a re-weighting method, and determining criteria and acquisition methods of underlying model parameters of the spacecraft are also provided. According to the thermal cycling test condition cutting method disclosed by the invention, the problem that a thermalcycling test condition cutting formula in MIL-STD-1540B and GJB 1027-2005 'Test Requirements for Launch Vehicles, Upper Stages and Spacecrafts' cannot cover the fault types of all types of the spacecrafts and all types of the subsystems can be solved, and the cost of the spacecrafts can be controlled on the basis of avoiding over-tests and under-tests.

Description

technical field [0001] The invention belongs to the technical field of thermal testing of spacecraft. Specifically, the present invention relates to a comprehensive tailoring method for thermal cycle test conditions of spacecraft, which is suitable for different spacecraft subsystems and thermal cycle test temperatures and cycles of different types of electronic component failures. Clipping of times condition. Background technique [0002] The thermal cycle test of spacecraft electronic equipment is an important link in the quality assurance of spacecraft hardware. As an easy-to-implement and efficient method, it has been widely used in the reliability and performance verification tests of various spacecraft. [0003] Generally speaking, at various stages of the spacecraft, such as stand-alone level, sub-system and system level thermal cycles, testing electronic equipment requires a large number of high and low temperature cycles in ground tests, so it is necessary to determ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 纪欣言王晶刘国青毕研强孙玉玮林博颖李西园
Owner BEIJING INST OF SPACECRAFT ENVIRONMENT ENG
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