Method for determining rationality of thermal cycling test condition cutting of spacecraft electronic equipment
A technology of electronic equipment and test conditions, applied in the fields of electrical digital data processing, instruments, special data processing applications, etc., can solve the problems of under-testing or over-testing of a single spacecraft, and the tailoring formula cannot cover the types of spacecraft subsystems, etc. Avoid the effects of over-testing and under-testing
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[0053] Embodiment 1: applied to thermal control subsystem TCS
[0054] according to figure 1 The specific steps of the method are as follows:
[0055] Step 1: Determine the total number of failure types of the subsystem m = 5, including five types of failures: solder joint failure, coating failure, component failure, wire failure, and circuit board thermal deformation.
[0056] Step 2: According to the historical fault distribution statistics of spacecraft subsystems, determine the fault weight coefficient a of TCS i , the values are shown in Table 3.
[0057] Table 3 Weight coefficients of thermal failure types of TTC subsystems
[0058] weight factor
a 1
a 2
a 3
a 4
a 5
Fault type
Solder joint failure
coating failure
Component failure
wire fault
Thermal deformation of the circuit board
value
0.5
0.12
0.04
0.2
0.14
[0059] Step 3: Count the material types of TCS electronic equipment, and...
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