High heating flux rack heat radiation cooling method and high heating flux rack composite heat exchanger

Abstract

The present invention relates to a high heating flux rack heat radiation cooling method and a high heating flux rack composite heat exchanger. The high heating flux rack composite heat exchanger comprises a rack heat exchanger and a heat transportation device. The rack heat exchanger is arranged at a back plate or a side plate of a rack and capable of performing exchange with heat air from a highheating flux rack and independently completing a full process of heat absorption and heat releasing, the heat transportation device is an independent device having one end being in surface contact with the rack heat exchanger and having the other end located at the external portion of the rack, the rack heat exchanger performs exchange with the heat air in the high heating flux rack and then transmits heat to one end of the heat transportation device with surface contact, and the heat transportation device transports heat to the other end through internal medium itself so as to take the heat out of the rack. The high heating flux rack composite heat exchanger can greatly save traditional air conditioning energy consumption and has very good safety and reliability.

Description

technical field [0001] The invention relates to the technical field of heat dissipation and cooling of cabinets, in particular to a high heat flux density cabinet heat dissipation and cooling method based on a micro heat pipe array plate and a composite heat exchanger thereof. Background technique [0002] With the rapid economic growth, data services are rising in a straight line, and data centers are developing rapidly. In the data room, the electronic devices (such as CPU, etc.) of the server in the cabinet are becoming more and more miniature and efficient, and the high heat generation of the server and its heat dissipation problem follow, and the evacuation and cooling of it has gradually become a data room. Research hotspots and difficulties, some studies have shown that when the temperature of the electronic chip exceeds the normal range of 10 ℃, the reliability of the system drops by 50%, and more than 55% of the failure of electronic equipment is caused by excessive...

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Problems solved by technology

[0004] Aiming at the problems of poor heat dissipation effect, poor reliability and safety, low power density and high energy consumption of the existing cabinet heat dissipation technology, the present invention provides a high heat flux density cabinet composite heat exchanger. The cabinet heat exchange device for heat exchange works together with the independent heat transport device that takes the heat inside the cabinet out of the cabinet, and the internal media of the two are physically isolated. The independent heat transport device can be further connected to an external independent cold source, not only It can effectively use the large temperature difference between the high-temperature air in the cabinet and the cooling medium to exchange heat, and the cooling medium will take the heat out of the machine room, making full use of natural cooling energy, which can greatly save the energy consumption of traditional air conditioners, and the composite heat exchanger Has excellent safety and reliability

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