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Device for preparing micron-order and/or millimeter-order coated powder by intermittent electrodeposition and processing method thereof

A treatment method and coating technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve problems such as unsatisfactory coating uniformity and coating defects, and achieve the effects of uniform replenishment, uniform thickness controllable, and good fluidity

Active Publication Date: 2018-01-09
INST OF PROCESS ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at problems such as the unsatisfactory coating uniformity and defects in the coating of micron-sized and / or millimeter-sized powders in the stirring mode of the existing powder electroplating device, the present invention provides a batch type electrodeposition production coated powder Device and method for its treatment

Method used

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  • Device for preparing micron-order and/or millimeter-order coated powder by intermittent electrodeposition and processing method thereof
  • Device for preparing micron-order and/or millimeter-order coated powder by intermittent electrodeposition and processing method thereof
  • Device for preparing micron-order and/or millimeter-order coated powder by intermittent electrodeposition and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] This embodiment provides a device for preparing coated powder by intermittent electrodeposition, such as figure 1 with figure 2 As shown, the device includes an electroplating tank 1, a power assembly, a cathode plate 4, an anode plate 5, a power supply 6, a power control device 7 and a support 8;

[0069] Wherein, a power assembly is arranged on one side of the electroplating tank 1, the cathode plate 4 is laid on the bottom of the electroplating tank 1, the anode plate 5 is arranged on the top of the electroplating tank 1 and is parallel to the cathode plate 4, and the power supply 6 is connected to the cathode plate 4 and the cathode plate 4 through wires. The anode plate 5 is connected; the power assembly includes a motor 2 and a motor transmission shaft 3, and the motor 2 is connected to one side of the electroplating tank 1 through the motor transmission shaft 3, and is sealed; the power assembly drives the electroplating tank 1 to rotate around the central axis ...

Embodiment 2

[0072] This embodiment provides a device for preparing coated powder by intermittent electrodeposition. The structure of the device is the same as that of Embodiment 1, the only difference is that the electroplating tank 1 is a closed cylinder; the cathode plate 4 The length is less than the length of the electroplating tank 1, the cathode plate 4 is a two-dimensional rectangle, the material of the cathode plate 4 is stainless steel, and the material of the anode plate is Sn-Ag alloy.

Embodiment 3

[0074] This embodiment provides a device for preparing coated powder by intermittent electrodeposition. The structure of the device is the same as that of Embodiment 1, the only difference being that the material of the cathode plate 4 is copper, and the material of the anode plate is Fe- Ni alloy.

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Abstract

The invention provides a device for preparing micron-order and / or millimeter-order coated powder by intermittent electrodeposition and a processing method thereof. The device comprises an electroplating tank, a power module, a cathode plate, an anode plate and a power supply; the power module is arranged on one side of a tank body of the electroplating tank; the cathode plate is paved at the bottom of the electroplating tank; the anode plate is arranged at the top of the electroplating tank, and is opposite to the cathode plate; and the power supply is connected with the cathode plate and theanode plate through leads. Through combination of self characteristics of micron-order and / or millimeter-order spherical powder, and through left-right reciprocating rotation of the electroplating tank around a center shaft, the micron-order and / or millimeter-order powder is fully stirred, and the thickness of a plated layer is uniform and controllable. On this basis, the faradic current law is combined, so that the device can be used for large-scale production of the micron-order and / or millimeter-order coated metal powder. The device and the method for preparing the micron-order and / or millimeter-order coated powder have the characteristics of low cost, capability of circulating, easiness in operation and large-scale production, and satisfy the demands in industrial production.

Description

technical field [0001] The invention belongs to the field of metal powder preparation, and relates to a device for producing coated powder by intermittent electrodeposition and a processing method thereof, in particular to a micron-sized and / or millimeter-sized metal-coated powder prepared by intermittent electrodeposition Devices and methods for their treatment. Background technique [0002] Electroless plating, also known as self-catalytic plating, refers to the principle that metal salts and reducing agents in the same solution can carry out self-catalytic oxidation-reduction reactions on the surface of a substrate with catalytic activity without an external current. A surface treatment technique for forming metal or alloy coatings by chemical deposition. Many researchers use electroless plating to achieve nickel, copper, and silver plating on the surface of the substrate. Electroless plating mainly has the characteristics of wide selection range of substrate, simple pr...

Claims

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Application Information

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IPC IPC(8): B22F1/02C25D5/18C25D17/20
Inventor 李建强邓楠马炳倩
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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