Flexible polyimide-based composite dielectric film material and preparation method and application thereof

A composite dielectric film and polyimide-based technology, applied in the field of dielectric materials, can solve problems such as not meeting the requirements of dielectric materials, achieve low thermal expansion coefficient, good cycle stability, and increase the effect of dielectric coefficient

Active Publication Date: 2019-10-15
GUANGDONG UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Polyimide organic dielectric materials have been successfully used in the fields of supercapacitors and electromagnetic thin-absorbing materials due to their excellent heat resistance and high dielectric properties, but they still cannot meet the requirements of high capacitance, high voltage and high frequency for dielectric materials. Require

Method used

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  • Flexible polyimide-based composite dielectric film material and preparation method and application thereof
  • Flexible polyimide-based composite dielectric film material and preparation method and application thereof
  • Flexible polyimide-based composite dielectric film material and preparation method and application thereof

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Effect test

Embodiment 1

[0032] 1. Stir and react pyromellitic dianhydride (PMDA) and 4,4-diaminodiphenyl ether (ODA) in a molar ratio of 1:1 at room temperature to generate polyamic acid (PAA);

[0033] 2. Put Ti 3 C 2 It is mixed with PAA at a mass ratio of 1:100, rolled on the cellulose ether film, and chemically imidized at 220°C to obtain a flexible polyimide-based composite dielectric film material.

[0034] The average thickness of the dielectric film obtained above is 15 μm, the dielectric constant is 8.73, and the thermal expansion coefficient is 0.51. It can still maintain good interface integrity after 5000 cycles as a supercapacitor dielectric material, and the mass loss is only 0.08%. figure 2 Ti of this embodiment 3 C 2 SEM photographs from figure 1 It can be clearly seen that Ti 3 C 2 The layered structure contributes to the increase of the dielectric constant in PI materials. image 3 The photo of the flexible polyimide composite dielectric material prepared for this embodiment...

Embodiment 2

[0036] 1. Will Stirring reaction at room temperature generates polyamic acid PAA in a molar ratio of 1:4;

[0037] 2.Nb 3 C 2 Mix it with PAA at a mass ratio of 1:1000, apply it on a stainless steel metal mesh by pulling method, and chemically imidize it at 400°C to obtain a flexible polyimide-based composite dielectric film material.

[0038] The average thickness of the obtained dielectric film is 25 μm, the dielectric constant is 9.74, the thermal expansion coefficient is 0.87, the maximum reflection loss as an electromagnetic absorbing material is 14.3%, and the absorption frequency is 0.01-10000 Hz.

Embodiment 3

[0040] 1. Will Stirring reaction at room temperature generates polyamic acid PAA in a molar ratio of 1:0.1;

[0041] 2.Ta 3 C 2 Mix it with PAA at a mass ratio of 1:500, spray it on the graphene film, and chemically imidize it at 320°C to obtain a flexible polyimide-based composite dielectric film material.

[0042] The average thickness of the dielectric film obtained by the test is 20 μm, the dielectric constant is 10.74, and the thermal expansion coefficient is 0.66. As a dielectric material for integrated circuit packaging, it can still maintain good interface integrity after 5000 cycles, and the mass loss is only 0.08%. The maximum reflection The loss is 12.3%, and the absorption frequency is 0.01-1000Hz.

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Abstract

The invention belongs to the field of dielectric materials and discloses a flexible polyimide-based composite dielectric film material and a preparation method thereof. The flexible polyimide-based composite dielectric film material is prepared by stirring MXene and polyamic acid formed by dianhydride and diamine at room temperature to obtain a mixed solution of MXene/PAA, coating a base materialwith the mixed solution of MXene/PAA, and amidating at 150-550 DEG C, wherein the MXene is Mn+1Xn, X is selected from C or N, M is selected from Sc, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo AND Mn transition metal elements. The preparation method of the flexible polyimide-based composite dielectric material is simple, the thickness is uniform and controllable, and the dielectric property is good; and as a supercapacitor device or an electromagnetic wave absorbing material, the flexible polyimide-based composite dielectric material has the characteristics of higher electromagnetic absorption efficiency, good cycle stability, small maximum reflection loss, wide absorption frequency range and the like.

Description

technical field [0001] The invention belongs to the field of dielectric materials, and more specifically relates to a flexible polyimide-based composite dielectric film material and its preparation method and application. Background technique [0002] Dielectric materials are an important part of supercapacitors, electromagnetic absorbing materials and integrated circuits, and their performance differences have a huge impact on components. With the development trend of miniaturization and complexity of integrated circuits, the development of flexible high-dielectric thin-film dielectric materials can not only meet the requirements of dielectric properties but also adapt to the configuration of modern electronic components, and exert better device performance. [0003] Polyimide organic dielectric materials have been successfully used in the fields of supercapacitors and electromagnetic thin-absorbing materials due to their excellent heat resistance and high dielectric proper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08K3/14C08K3/28
CPCC08G73/1071C08G73/1003C08K3/14C08K3/28C08J5/18C08J2379/08
Inventor 闵永刚刘荣涛刘屹东王勇廖松义张诗洋庞贻宇肖天华
Owner GUANGDONG UNIV OF TECH
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