Flexible polyimide-based composite dielectric film material and preparation method and application thereof

A composite dielectric film and polyimide-based technology, applied in the field of dielectric materials, can solve problems such as not meeting the requirements of dielectric materials, achieve low thermal expansion coefficient, good cycle stability, and increase the effect of dielectric coefficient
CN110330646AActive Publication Date: 2019-10-15GUANGDONG UNIV OF TECH +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG UNIV OF TECH
Publication Date
2019-10-15

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Abstract

The invention belongs to the field of dielectric materials and discloses a flexible polyimide-based composite dielectric film material and a preparation method thereof. The flexible polyimide-based composite dielectric film material is prepared by stirring MXene and polyamic acid formed by dianhydride and diamine at room temperature to obtain a mixed solution of MXene / PAA, coating a base materialwith the mixed solution of MXene / PAA, and amidating at 150-550 DEG C, wherein the MXene is Mn+1Xn, X is selected from C or N, M is selected from Sc, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo AND Mn transition metal elements. The preparation method of the flexible polyimide-based composite dielectric material is simple, the thickness is uniform and controllable, and the dielectric property is good; and as a supercapacitor device or an electromagnetic wave absorbing material, the flexible polyimide-based composite dielectric material has the characteristics of higher electromagnetic absorption efficiency, good cycle stability, small maximum reflection loss, wide absorption frequency range and the like.
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Description

technical field

[0001] The invention belongs to the field of dielectric materials, and more specifically relates to a flexible polyimide-based composite dielectric film material and its preparation method and application. Background technique

[0002] Dielectric materials are an important part of supercapacitors, electromagnetic absorbing materials and integrated circuits, and their performance differences have a huge impact on components. With the development trend of miniaturization and complexity of integrated circuits, the development of flexible high-dielectric thin-film dielectric materials can not only meet the requirements of dielectric properties but also adapt to the configuration of modern electronic components, and exert better device performance.

[0003] Polyimide organic dielectric materials have been successfully used in the fields of supercapacitors and electromagnetic thin-absorbing materials due to their excellent heat resistance and high dielectric proper...

Claims

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