Ink exposure process for improving alignment accuracy efficiency
A technology of alignment accuracy and process, applied in microlithography exposure equipment, photolithography process exposure devices, electrical components, etc., can solve the problems of dust on circuit boards, exposure process can not solve the problem of dust, etc., to achieve good quality, Good dust removal effect and good exposure effect
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[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0021] refer to Figure 1-2 , an ink exposure process that improves the efficiency of alignment accuracy, the process includes an exposure device and a circuit board, and the circuit board is arranged on the conveyor belt 3 of the exposure device, the exposure device includes a workbench 1, and the top of the workbench 1 is installed in a horizontal direction There is a conveyor belt 3, the two sides of the conveyor belt 3 are fixed with vertical plates 4 arranged in parallel, the top of the two vertical plates 4 is fixed with a top plate 6, the bottom of the top plate 6 is equipped with a first ultraviolet lamp 9, the face of the top plate 6 Both sides are equipped ...
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