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Ink exposure process for improving alignment accuracy efficiency

A technology of alignment accuracy and process, applied in microlithography exposure equipment, photolithography process exposure devices, electrical components, etc., can solve the problems of dust on circuit boards, exposure process can not solve the problem of dust, etc., to achieve good quality, Good dust removal effect and good exposure effect

Inactive Publication Date: 2018-01-09
JIANGXI KAIQIANG IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the circuit board is processed, it is necessary to expose the solder resist ink on the circuit board, and the ink needs to be exposed. The existing exposure process cannot solve the dust problem, and it is easy to make the circuit board stick to dust. Therefore, the present invention proposes a lifting alignment Accurate and efficient ink exposure process to solve the deficiencies of the existing technology

Method used

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  • Ink exposure process for improving alignment accuracy efficiency
  • Ink exposure process for improving alignment accuracy efficiency

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0021] refer to Figure 1-2 , an ink exposure process that improves the efficiency of alignment accuracy, the process includes an exposure device and a circuit board, and the circuit board is arranged on the conveyor belt 3 of the exposure device, the exposure device includes a workbench 1, and the top of the workbench 1 is installed in a horizontal direction There is a conveyor belt 3, the two sides of the conveyor belt 3 are fixed with vertical plates 4 arranged in parallel, the top of the two vertical plates 4 is fixed with a top plate 6, the bottom of the top plate 6 is equipped with a first ultraviolet lamp 9, the face of the top plate 6 Both sides are equipped ...

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Abstract

The invention discloses an ink exposure process for improving alignment accuracy efficiency. The process comprises an exposure device and a circuit board, wherein the circuit board is arranged on a conveying belt of the exposure device, the exposure device comprises a workbench, the conveying belt is arranged at the top of the workbench in a horizontal direction, vertical plates are fixedly arranged at two sides of the conveying belt and are arranged in parallel, a top plate is fixedly arranged at tops of the two vertical plates, a first ultraviolet lamp is arranged at the bottom of the top plate, push rod motors are arranged at two sides of a face part of the top plate, dust catchers are fixedly arranged at the bottoms of the push rod motors, the two dust catchers are respectively arranged at two sides of the first ultraviolet lamp, support blocks are fixedly arranged on side surfaces of the vertical plates, support plates are fixedly arranged at tops of the support blocks, second ultraviolet lamps are arranged at the tops of the support plates and are parallel to each other, a charge coupled device (CCD) alignment lens is arranged between adjacent second ultraviolet lamps, and the support blocks are arranged at middle positions of the conveying belts. The ink exposure process is good in dust removal effect and good in exposure effect and is suitable for promotion.

Description

technical field [0001] The invention relates to the technical field of ink exposure technology, in particular to an ink exposure technology for improving alignment precision efficiency. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can be called printed circuit board or printed circuit board, the English name is (Printed Circuit Board) PCB, (Flexible Printed Circuit board) FPC circuit board [1] (FPC circuit board is also called flexible circuit ...

Claims

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Application Information

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IPC IPC(8): G03F7/20H05K3/00
Inventor 官章青
Owner JIANGXI KAIQIANG IND CO LTD