Cleaning method for the cleaning box and the inner wall of the cleaning box

A technology for cleaning boxes and cleaning liquids, which is applied in the directions of cleaning methods, cleaning methods and utensils, chemical instruments and methods using liquids, etc., can solve the problems of low cleaning efficiency of the inner wall of the cleaning box, and improve self-cleaning efficiency and manufacturing efficiency. , the effect of saving human resources

Active Publication Date: 2020-05-29
淮安西德工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a cleaning box and a cleaning method for the inner wall of the cleaning box, which is used to solve the problem of low cleaning efficiency of the inner wall of the cleaning box in the prior art and save human resources

Method used

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  • Cleaning method for the cleaning box and the inner wall of the cleaning box
  • Cleaning method for the cleaning box and the inner wall of the cleaning box
  • Cleaning method for the cleaning box and the inner wall of the cleaning box

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no. 1 Embodiment approach

[0024] This specific embodiment provides a cleaning box, with figure 2 It is a top view structure schematic diagram of the cleaning box according to the first specific embodiment of the present invention, with image 3 is attached figure 2 Sectional view along A-A direction. like figure 2 , 3 As shown, the cleaning box provided in this specific embodiment includes a box body, the inner wall of the box is provided with a fluid channel 25, and the cleaning liquid can flow out through the fluid channel 25 to cover the inner surface 222 of the inner wall 22; The inner wall 22 of the box body also includes an interlayer, and at least one ultrasonic transducer 23 is arranged in the interlayer, and the ultrasonic transducer 23 is used to emit ultrasonic waves, and the ultrasonic waves act on the cleaning liquid to realize cleaning. Cleaning of the inner wall 22. In this specific embodiment, the box includes an inner wall 22 and an outer wall 21 , the inner wall 22 forms a waf...

no. 2 Embodiment approach

[0033] This specific embodiment provides a cleaning method for cleaning the inner wall of the box, with Figure 4 It is a flow chart of the cleaning method for cleaning the inner wall of the tank according to the second embodiment of the present invention. like Figure 4 As shown, the cleaning method for the inner wall of the cleaning box described in this specific embodiment includes the following steps:

[0034] Step S31, providing a box body of a cleaning box, the inner wall of the box body is provided with a fluid channel, and the inner wall of the box body also includes an interlayer, and at least one ultrasonic transducer is arranged in the interlayer for emitting ultrasonic waves . In this specific embodiment, the interlayer can be arranged on the side, top or bottom of the inner wall, and those skilled in the art can choose according to actual needs. The following description will be made by taking the interlayer disposed on the side of the inner wall as an example....

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning box and a cleaning method for the inner wall of the cleaning box. The cleaning box comprises abox body. A fluid channel is arranged on the inner wall of the box body, and cleaning fluid can flow out of the fluid channel so as to cover the inner surface of the inner wall. The inner wall of thebox body further comprises an interlayer, and at least one ultrasonic transducer is arranged in the interlayer for transmitting ultrasonic waves. The ultrasonic waves act on the cleaning fluid so as to achieve inner wall cleaning. By means of the cleaning box and the cleaning method for the inner wall of the cleaning box, automatic cleaning box inner wall cleaning is achieved, crystals are prevented from being generated on the inner wall of the cleaning box, manpower resources are saved, and the cleaning box cleaning efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning box and a cleaning method for the inner wall of the cleaning box. Background technique [0002] With the rapid development of integrated circuit manufacturing technology, the feature size of integrated circuits is continuously reduced, and the number of semiconductor devices on a semiconductor wafer is continuously increased. In order to meet the requirements of increasing the number of semiconductor devices, a semiconductor wafer often includes semiconductor devices with a multi-layer structure, and the semiconductor devices on adjacent layers are electrically connected through a metal interconnection structure, thereby increasing the number of semiconductor devices on a specific area of ​​the wafer. The number of devices increases the integration of semiconductor devices. However, as the structure of integrated circuits becomes more and more comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/12B08B3/08B08B9/08B08B13/00H01L21/67
Inventor 王海宽林宗贤吴龙江郭松辉吕新强
Owner 淮安西德工业设计有限公司
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