Chip-level MEMS (micro electro mechanical system) rotation modulation gyroscope preparation method
A rotary modulation, chip-level technology, applied in the fields of inertial technology and micro-electromechanical systems, can solve the problems of high assembly precision requirements and difficult installation, and achieve the effect of small size
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[0026] In this embodiment, the preparation process of the chip-level MEMS rotary modulation gyroscope is as follows:
[0027] first step, Figure 4 As shown in (a), the glass sheet 1 is cleaned; the upper surface of the glass sheet 1 is coated with photoresist 2, and the thickness of photoresist 2 is 500nm;
[0028] second step, Figure 4 As shown in (b), photolithography, development, metal film 3 is sputtered on the surface of photoresist 2, the material of metal film 3 is gold, and the thickness is 200nm;
[0029] third step, Figure 4 As shown in (c), clean the SOI wafer 3, the crystal orientation of the SOI wafer 3 is , perform ICP dry etching on the base layer 4 of the SOI wafer 3, and the etching depth is 10 μm to obtain steps and the area of the steps 500μm×500μm;
[0030] the fourth step, Figure 4 As shown in (d), remove the photoresist 2 on the upper surface of the glass sheet 1 to obtain the metal electrode 12 and the metal electrode 13; then clean the SOI w...
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