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Attraction device, method for producing attraction device, and vacuum processing device

A technology of vacuum processing device and adsorption device, which is applied to holding devices, manufacturing tools, positioning devices, etc. using electrostatic attraction, can solve the problems of reduced substrate yield and wrong substrate transportation, and achieves extended life, dust prevention, general-purpose Sexually wide effect

Active Publication Date: 2018-01-19
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Furthermore, since the remaining adsorption force due to the shortening of the output time in the manufacturing process is used as a cause, there will be problems such as substrate transport errors or a decrease in the yield per substrate. Therefore, it is also desirable to increase the adsorption force of the adsorption device. control in a uniform manner

Method used

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  • Attraction device, method for producing attraction device, and vacuum processing device
  • Attraction device, method for producing attraction device, and vacuum processing device
  • Attraction device, method for producing attraction device, and vacuum processing device

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Embodiment Construction

[0038] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0039] In addition, the present invention can be applied to both bipolar and monopolar adsorption devices.

[0040] figure 1 It is a schematic configuration diagram of a sputtering apparatus which is an embodiment of the vacuum processing apparatus of the present invention.

[0041] exist figure 1 In the figure, reference numeral 2 denotes a vacuum chamber of the sputtering apparatus 1 according to the present embodiment, and the vacuum chamber 2 is configured to be connected to a vacuum exhaust system (not shown) to introduce sputtering gas.

[0042] The target 3 as a film formation source is arrange|positioned in the upper part in the vacuum chamber 2. As shown in FIG.

[0043] The target 3 is connected to a sputtering power supply 4, and a negative bias voltage is applied thereto. In addition, the positive side of the sputtering power supply 4 is grounded togethe...

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Abstract

The present invention provides a technique with which it is possible to suppress the generation of dust at the time of attracting and detaching an object to be attracted, and to control the attractionforce of an attraction device so as to be uniform. This attraction device comprises: a main body part 50 including attraction electrodes 11, 12 in a dielectric; and an attraction part 51 that is provided on an attraction-side surface of the main body part 50 and that attracts a substrate. The attraction part 51 includes: a contact support part 52 that contacts and supports the substrate; and a non-contact part 53 that does not contact the substrate. The attraction part 51 is constituted such that the volume resistivity of the material of the contact support part 52 is greater than the volumeresistivity of the material of the non-contact part 53.

Description

technical field [0001] The present invention relates to a suction device for suction-holding a substrate in a vacuum, and more particularly to a technology for a suction device for suction-holding a substrate having an insulating film on the back surface and an insulating substrate. Background technique [0002] Conventionally, in a sputtering apparatus or the like, an electrostatic adsorption apparatus has been widely used in order to precisely control the temperature of a substrate. As an apparatus for performing processes such as film formation on an insulating substrate such as glass in a vacuum, an adsorption device that adsorbs and holds an insulating substrate using a gradient force is widely used. In addition, in the case of performing electrostatic adsorption on a substrate having an insulating film on the back surface, methods such as increasing the adsorption voltage to increase the adsorption force are adopted. [0003] In such an adsorption device, the entire s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H02N13/00B23Q3/15
CPCH01L21/67253H01L21/6833H01J37/32715H01J37/34B23Q3/15H02N13/00H01L21/683
Inventor 前平谦不破耕
Owner ULVAC INC
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