Dynamic magnetic field magneto-rheological polishing device

Abstract

The invention discloses a dynamic magnetic field magneto-rheological polishing device which comprises a shell, a power input mechanism and a rotating mechanism. An inner gear is arranged in the shell,the middle of the shell is provided with a center bearing sleeve, the power input mechanism comprises an input shaft, the input shaft is connected to the inner wall of the center bearing sleeve through a first bearing, the outer wall of the input shaft is provided with a center gear, the rotating mechanism comprises a shaft, a shaft sleeve, a planetary gear, a bearing sleeve retainer and a shaftretainer, the lower end of the shaft is provided with a cylinder permanent magnet, the lower end of the shaft sleeve is provided with a polishing disc, and the lower surface of the polishing disc is provided with a groove. Under the effect of a dynamic magnetic field, a magneto-rheological fluid polishing pad without abrasive material update can be made to be converted into the polishing pad capable of being restored in real time and having the shelf sharpness and shape of the abrasive material. In addition, polishing machining uniformity and efficiency are improved, complete revolution and self revolution of the polishing disc and forming multiple work of the dynamic magnetic field and fluid dynamic pressure are achieved under power input, no motor needs to be added for driving a magneticpole to rotate, and the device structure is compact.

Description

technical field [0001] The invention relates to the technical field of polishing devices, in particular to a dynamic magnetic field magnetorheological polishing device. Background technique [0002] With the development of electronic information society, semiconductor materials are widely used as high-performance microelectronic components, such as single crystal silicon, aluminum oxide, strontium titanate and single crystal silicon carbide and other electronic ceramic materials are in increasing demand. Generally, the manufacture of semiconductor wafers needs to go through slicing, grinding, polishing and other processes. To achieve good performance, the surface accuracy needs to reach ultra-smoothness (roughness Ra below 1nm), and the surface accuracy also has high requirements (surface accuracy reaches 0.5 microns), taking LED epitaxial sapphire substrates as an example, it is generally required that the total thickness deviation is less than 10 μm, the total surface flat...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a dynamic magnetic field magnetorheological polishing device, which can effectively solve the problems of uneven polishing in existing magnetorheological polishing

Images