Film-clamping prevention type PCB electroplating method

Abstract

The present invention provides a film-clamping prevention type PCB electroplating method. The method comprises the steps of cutting materials; drilling holes; cleaning; image transferring; obtaining apattern of a conductive line through the exposing and developing operation on a copper foil of a copper-clad board, wherein the pitch of the conductive line is set to be d and 3 mil<=d<=5 mil; conducting the m / mOZ electroplating: electroplating a first copper layer on the copper foil exposed to the air, wherein the current density is 1.4 to 1.6 ASD, and the time lasts for 30-40 minutes; conducting the n / nOZ electroplating: electroplating a second copper layer on the first copper layer, wherein the current density is 1.6 to 1.8 ASD, and the time lasts for 80-90 minutes; conducting the anticorrosion electroplating; film removing; line etching; and conducting the seal welding. According to the invention, the coated metal is effectively prevented from being covered onto a solder mask dry filmduring the electroplating process, so that the occurrence probability of the film-clamping condition during the electroplating process can be reduced. Furthermore, the rejection rate of PCBs is reduced. In addition, electroplating layers are prevented from being too thick, and are uniform in thickness.

Description

technical field [0001] The invention relates to the field of electroplating of PCB boards, and specifically discloses an electroplating method for PCB boards of an anti-clip film. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) has at least one conductive pattern attached to it, and is equipped with holes and grooves to realize the interconnection between electronic components, which is the basis of almost all electronic products. Generally speaking, if there are electronic components in a certain device, they are also integrated on PCB boards of various sizes. In addition to fixing various components, the main function of the PCB board is to provide connection circuits between various components. The conductive metal substrate is the basis of the multilayer PCB board, and each layer of circuit is made on both sides of the conductive metal substrate to form a multilayer PCB board. [0003] Since the thickness of electroplated copper is grea...

AI Technical Summary

Problems solved by technology

[0003] Since the thickness of electroplated copper is greater than the thickness of the dry film, the short circuit caused by the copper under the dry film not being etched clean is called electroplating interlayer film, which will affect the performance of the PCB board and even cause the PCB board to be scrapped.