Heat dissipation structure used for surface of microelectronic chip

Abstract

The invention discloses a heat dissipation structure used for the surface of a microelectronic chip. The heat dissipation structure comprises a chip substrate and a heat conducting sheet; the heat conducting sheet is arranged on the surface of the chip substrate; a plurality of through holes are formed in the heat conducting sheet; heat conducting silica gel cushions are arranged in the through holes; a plurality of wet conduction fiber pipes are arranged on the surface of the heat conducting sheet; the wet conduction fiber pipes are arranged uniformly; heat dissipation heat pipes are arrangedbetween adjacent wet conduction fiber pipes; each heat dissipation heat pipe comprises a heat absorption section, an evaporation section and a condensation section which are connected in sequence from the bottom up; the heat absorption section and the heat conducting sheet are fixedly connected together; the top end of the condensation section is connected with an aluminum sheet; the aluminum sheet comprises an arc-shaped section and a horizontal section; and the arc-shaped section is higher than the horizontal section. By virtue of combination of a direct heat conduction mode and an indirectheat dissipation mode entirely, the microelectronic chip can be subjected to high heat dissipation, so that the temperature of the microelectronic chip can be lowered effectively, the chip can be protected effectively, the service life can be prolonged, and the heat dissipation structure is worthy of popularization.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a heat dissipation structure used on the surface of a microelectronic chip. Background technique [0002] Microelectronics technology is a new technology developed along with integrated circuits, especially VLSIs. The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. With the development of microelectronics technology, microelectronic chips are becoming more and more popular, but because microelectronic chips need to work for a long time, they will generate a certain amount of heat. If the heat cannot be dissipa...

AI Technical Summary

Problems solved by technology

The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. With the development of microelectronics technology, microelectronic chips are becoming more and more popular, but because microelectronic chips need to work for a long time, they will generate a certain amount of heat. If the heat cannot be dissipated in time, it will cause damage to the microelectronic chip and affect the work and service life of the chip

Images