Liquid-cooling liquid homogenizing device and liquid-cooling radiator applying same

Abstract

The invention discloses a liquid-cooling liquid homogenizing device, which comprises an open liquid collecting box used for collecting a liquid cooling working medium, and is characterized in that a bottom plate of the liquid collecting box is a capillary liquid homogenizing plate used for equally dividing the liquid cooling working medium, the capillary liquid homogenizing plate is plate-shaped and of a capillary structure with numerous pores, the liquid collecting box is provided with a fixing component used for being fixed on a radiator of a heating device, the liquid homogenizing device isused for being fixed right above radiating fins of the radiator of the heating device, the liquid cooling working medium in the liquid collecting box is enabled to flow to the radiating fins throughthe pores under the action of gravity, be uniformly distributed to each radiating fin through a capillary action and flow along the surface of each radiating fin, and the heat at the surfaces of the radiating fins is uniformly and quickly taken away. According to the invention, the liquid cooling working medium is enabled to be quickly, comprehensively and uniformly distributed to the radiating fins of the radiator of the heating device through the capillary action, the utilization rate of the liquid cooling working medium can reach up to 100%, and targeted, centralized and uniform spraying ofthe liquid cooling working medium for the heating device can be realized.

Description

technical field [0001] The invention belongs to the field of liquid cooling and heat dissipation of heating devices, and in particular relates to a liquid cooling homogenizer and a liquid cooling radiator using the liquid cooling homogenizer, which is mainly applied to the heat dissipation of heating devices in data center servers. Background technique [0002] Today, with the rapid development of network technology, electronic components are increasingly integrated, miniaturized, and high-power, which puts forward higher requirements for the heat dissipation of electronic components. The traditional air-cooling technology can no longer meet the heat dissipation needs of high-power occasions such as existing data centers. At present, more and more data centers are gradually adopting liquid cooling methods for heat dissipation. [0003] The applicant's invention patent application (application number: 201610439358.3) discloses a working medium contact cooling system for a hig...

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Problems solved by technology

[0004] Although the above-mentioned working fluid spray contact cooling system effectively solves the heat dissipation problem of high-power devices, this cooling system and other existing liquid spray methods still have the following disadvantages: when the liquid working fluid sprays and contacts When the heating element is used, it is impossible to ensure that the heating element is sprayed in a targeted, concentrated and uniform manner, causing the liquid working fluid to accumulate in the non-heating main part, but the heating main part cannot perform good heat dissipation, resulting in poor cooling effect, and The cooling efficiency is low, which directly affects the heat dissipation effect of the cooling system and the operating quality of the heating element

In addition, the liquid working medium has not been fully utilized, resulting in waste in disguise

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