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Full-automatic tin cream printing machine capable of achieving powder supplementing

A solder paste printing machine, fully automatic technology, applied to printing machines, rotary printing machines, screen printing machines, etc., can solve problems such as unsatisfactory deflection and insufficient blade angle adaptability

Inactive Publication Date: 2018-02-16
连江捷恒工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the solder paste printing of printed circuit boards (PCB) is mostly completed by semi-automatic solder paste printing machines or fully automatic solder paste printing machines, and is composed of multiple production systems. Each system cooperates with each other and completes its own tasks to ensure Integrity of circuit board printing, one of the most important links is the solder paste printing link. For example, the Chinese patent document with the application number CN201420229924.4 has announced the suspension scraper system of the automatic solder paste printing machine. In this technical solution In, "the front knife support shaft is equipped with a front knife limit block located above the front knife connecting plate" to realize "the suspended blade can automatically adapt to the surface of the steel mesh to ensure that the solder paste can be evenly printed on the PCB ", however, the height distance between the front knife connecting plate and the front knife limit block is too small, and because the distance is a fixed distance, the angle adaptability of the blade is not sufficient, and it cannot meet the deflection of a large angle

Method used

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  • Full-automatic tin cream printing machine capable of achieving powder supplementing
  • Full-automatic tin cream printing machine capable of achieving powder supplementing
  • Full-automatic tin cream printing machine capable of achieving powder supplementing

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Example 1, such as figure 1 Shown is a structural schematic diagram of a fully automatic solder paste printing machine that can replenish powder, a fully automatic solder paste printing machine that can replenish powder, including a casing, a clamping and lifting system, a platform correction system, a guide rail transportation system, and a steel mesh Frame clamping system, doctor blade printing system and subsequent cleaning system, among which, such as figure 2 , image 3 As shown, the scraper printing system includes a fixed frame 1, a through shaft 2 and a scraper 6, the scraper 6 is fixed at the lower end of the fixed frame 1, the through shaft 2 includes a threading part 21, and a tightening part 22 installed on the threading part 21, The fixed frame 1 is sleeved on the threading part 21 through the through hole 4, and there is a turning part 3 above the fixing frame 1. The turning part 3 includes a turning surface 31 and is used to connect the threading part 2...

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PUM

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Abstract

The invention provides a full-automatic solder paste printing machine that can replenish powder. The adjustable rotation angle of the scraper is designed so that the scraper can meet different needs. The printing process is terminated due to the lack of paste powder, including the casing, clamping and lifting system, platform correction system, guide rail transportation system, stencil frame clamping system, scraper printing system and subsequent cleaning system, wherein the scraper printing system includes a fixed frame , through the shaft and the scraper, there is a powder replenishing part for supplementing the amount of solder paste powder on the fixed frame, and the powder replenishment part includes a powder filling part for adding solder paste powder, a storage part for storing solder paste powder Powder storage cavity and powder outlet.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a fully automatic solder paste printing machine capable of replenishing powder. Background technique [0002] The application of electronic products has penetrated into all aspects of life, and people's manufacturing requirements for electronic products are getting higher and higher, because electronic products are becoming smaller and more sophisticated, and the production of printed circuit boards (PCBs) of electronic products must be produced by surface mount technology (SMT) ) equipment, the solder paste printing of the first process of production is done by the solder paste printing machine, so the processing of the first process largely determines the production quality of printed circuit boards (PCB). At present, the solder paste printing of printed circuit boards (PCB) is mostly completed by semi-automatic solder paste printing machines or fully automa...

Claims

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Application Information

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IPC IPC(8): B41F15/08B41F15/44B41F15/40B41F15/14H05K3/34
CPCB41F15/08B41F15/14B41F15/40B41F15/44H05K3/34
Inventor 雷才俊
Owner 连江捷恒工业设计有限公司
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