Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Full-automatic tin paste printer for cleaning

A solder paste printing machine, fully automatic technology, used in printing machines, rotary printing machines, screen printing machines, etc., can solve the problems of affecting the yield, difficult to rule out that the circuit board is not stained with dust, and cannot be used normally. Improve utilization, facilitate flushing, and improve efficiency

Inactive Publication Date: 2018-02-16
连江捷恒工业设计有限公司
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

"This technical solution does not clean up the circuit board to be printed, so that if the original debris on the circuit board is attached, it will not be able to be used normally even after the entire printed circuit board process is completed, which will affect the yield rate, because it is difficult for us to Exclude the circuit board from dust or attachments before being transported to the automatic solder paste printing machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full-automatic tin paste printer for cleaning
  • Full-automatic tin paste printer for cleaning
  • Full-automatic tin paste printer for cleaning

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1, such as figure 1 Shown is an overall schematic diagram of a clean automatic solder paste printing machine, a clean automatic solder paste printing machine, including the casing, clamping and lifting system, platform correction system, guide rail transportation system, and stencil frame clamping system , scraper printing system and follow-up cleaning system, which also includes the pre-cleaning system, such as figure 2 As shown, the pre-cleaning system includes a splint track 1 for clamping and moving the circuit board, a first water outlet 2 for spraying water on the circuit board, a water collection bottom tank 3 for collecting water flowing through the circuit board, and In the drying part 4 of the drying circuit board, the first water outlet 2 is located above the entrance of the splint track 1, the water collection bottom tank 3 is located below the splint track 1, and the drying part 4 is located at the end of the splint track 1. The splint track 1 inc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a clean automatic solder paste printing machine, which cleans the circuit board that is about to enter the processing program, so as to ensure that the surface of the circuit board is clean before printing in the automatic solder paste printing machine, so as to improve the efficiency of circuit board printing. , After the yield. Including the casing, clamping and lifting system, platform correction system, guide rail transportation system, stencil frame clamping system, scraper printing system and subsequent cleaning system, which also includes the pre-cleaning system, the pre-cleaning system includes And move the splint track of the circuit board, the first water outlet for spraying water to the circuit board, the water collection bottom tank for collecting the water flowing through the circuit board, and the drying part for drying the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a clean automatic solder paste printing machine. Background technique [0002] The application of electronic products has penetrated into all aspects of life, and people's manufacturing requirements for electronic products are getting higher and higher, because electronic products are becoming smaller and more sophisticated, and the production of printed circuit boards (PCBs) of electronic products must be produced by surface mount technology (SMT) ) equipment, the solder paste printing of the first process of production is done by the solder paste printing machine, so the processing of the first process largely determines the production quality of printed circuit boards (PCB). At present, the solder paste printing of printed circuit boards (PCBs) is mostly completed by semi-automatic solder paste printing machines or fully automatic solder paste printing mach...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B41F15/12B41F23/00H05K3/34H05K3/26
CPCB41F15/12B41F23/00B41P2215/50B41P2235/26H05K3/26H05K3/341
Inventor 雷才俊
Owner 连江捷恒工业设计有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com