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Low-formaldehyde adhesive for parquet

A solid wood composite flooring and adhesive technology, applied in the direction of adhesive types, starch adhesives, adhesive additives, etc., can solve the problems of unstable formaldehyde release, unqualified peel strength, etc., to solve formaldehyde pollution, The effect of low formaldehyde emission

Inactive Publication Date: 2018-02-16
GUANGXI ZHONGCHANG RESIN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides an adhesive for solid wood composite flooring with low formaldehyde, which can solve the problem that the formaldehyde release amount of the adhesive for solid wood composite flooring is unstable, exceeds the standard or the peel strength is unqualified in most cases

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] The raw materials used for this low-formaldehyde parquet adhesive are: polydiphenylmethane diisocyanate 10kg, polyvinyl alcohol 40kg, styrene-butadiene latex 25kg, corn starch 20kg, zinc oxide 3kg, magnesium oxide 3kg, borax 3kg .

[0013] The production method is:

[0014] A. After mixing polyvinyl alcohol with water, add it to the reaction kettle, raise the temperature to 70°C under constant stirring, and keep it warm until it is completely dissolved;

[0015] B. Cool down the temperature obtained in step A to 40°C, add cornstarch and borax, adjust the pH value to 7-8, and fully stir for 40 minutes at a temperature of 30°C to obtain an emulsion for later use;

[0016] C, the emulsion obtained in step B is fully stirred and mixed with styrene-butadiene latex, zinc oxide and magnesium oxide at room temperature, and the main agent has been made;

[0017] D. Fully stir and mix the main agent and polydiphenylmethane diisocyanate in a certain proportion.

Embodiment 2

[0019] The raw materials used for this low-formaldehyde solid wood composite flooring adhesive are: 20kg of polydiphenylmethane diisocyanate, 50kg of polyvinyl alcohol, 35kg of styrene-butadiene latex, 25kg of corn starch, 5kg of zinc oxide, 5kg of magnesium oxide, and 5kg of borax .

[0020] The production method is:

[0021] A. After mixing polyvinyl alcohol with water, add it to the reaction kettle, raise the temperature to 70°C under constant stirring, and keep it warm until it is completely dissolved;

[0022] B. Cool down the temperature obtained in step A to 40°C, add cornstarch and borax, adjust the pH value to 7-8, and fully stir at 40°C for 30 minutes to obtain an emulsion for later use;

[0023] C, the emulsion obtained in step B is fully stirred and mixed with styrene-butadiene latex, zinc oxide and magnesium oxide at room temperature, and the main agent has been made;

[0024] D. Fully stir and mix the main agent and polydiphenylmethane diisocyanate in a certain...

Embodiment 3

[0026] The raw materials used for this low-formaldehyde parquet adhesive are: polydiphenylmethane diisocyanate 15kg, polyvinyl alcohol 45kg, styrene-butadiene latex 30kg, corn starch 22kg, zinc oxide 4kg, magnesium oxide 4kg, borax 4kg .

[0027] The preparation method is the same as in Example 1.

[0028] Test with reference to the requirements of Class II adhesives specified in GB / T 14074-1993. Mainly inspect the appearance, viscosity, pH value, solid content, pot life, storage stability.

[0029] The test results are as follows:

[0030] .

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PUM

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Abstract

The invention discloses a low-formaldehyde adhesive for parquet and relates to the technical field of adhesives. The adhesive for the parquet is prepared from raw materials in parts by weight as follows: 10-20 parts of poly-diphenylmethane diisocyanate, 40-50 parts of polyvinyl alcohol, 25-35 parts of latex, 20-25 parts of corn starch, 3-5 parts of zinc oxide, 3-5 parts of magnesium oxide and 3-5parts of borax. The problems that the formaldehyde release amount of the adhesive for the parquet is unstable and exceeds the stands or the peel strength is unqualified in most cases are solved.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive for low-formaldehyde solid wood composite flooring. Background technique [0002] The three-layer solid wood composite floor is becoming more and more popular in many economically developed regions in the world, especially in European and American countries, and is widely favored and widely used for its beauty, elegance, strong decoration, good dimensional stability, and low formaldehyde emission. It is used in hotels, shopping malls, dance halls and home floor decoration, and the annual demand is increasing by 20%. Most domestic manufacturers of three-layer solid wood composite flooring use self-made urea-formaldehyde glue or imported powdery glue. The biggest disadvantage of self-made low-toxic urea-formaldehyde glue is that the amount of formaldehyde released is unstable, and in most cases it exceeds the standard or the peel strength is unqualified. Imported gl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J129/04C09J175/04C09J109/08C09J103/02C09J11/04
CPCC09J129/04C08K2003/222C08K2003/2296C08K2003/387C08L2205/035C09J11/04C08L75/04C08L9/08C08L3/02C08K3/22C08K3/38
Inventor 蒋茵荣黄桂彬
Owner GUANGXI ZHONGCHANG RESIN
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