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Substrate processing apparatus and substrate processing method

A substrate processing device and technology for a substrate processing method are applied in chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., and can solve problems such as difficulty in improving the removal rate of contaminants.

Active Publication Date: 2021-05-11
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, it is difficult to improve the removal rate of pollutants

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Embodiments are illustrated below with reference to the drawings. In addition, the same reference numerals are assigned to the same components in the respective drawings, and detailed description thereof will be appropriately omitted.

[0022] The substrate 100 exemplified below may be, for example, a semiconductor wafer, a template for imprinting, a mask blank for lithography, a plate-shaped body for MEMS (Micro Electro Mechanical Systems), or the like.

[0023] However, the use of the substrate 100 is not limited to these.

[0024] figure 1 It is a schematic diagram for illustrating the substrate processing apparatus 1 according to this embodiment.

[0025] like figure 1 As shown, the substrate processing apparatus 1 is provided with a placement unit 2, a cooling unit 3, a first liquid supply unit 4, a second liquid supply unit 5, a frame body 6, an air supply unit 7, a measurement unit 8, a control unit 9 and a discharge unit. gas section 11.

[0026] The placem...

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PUM

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Abstract

The invention provides a substrate processing device and a substrate processing method, which can improve the removal rate of pollutants. The substrate processing apparatus according to the embodiment includes: a placement unit for placing and rotating a substrate; a liquid supply unit for supplying liquid to a surface of the substrate opposite to the side of the placement unit; and a cooling unit for supplying liquid to the surface of the substrate. A cooling gas is supplied to a surface on the side of the placement unit; and a control unit controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control unit puts the liquid on the substrate surface in a supercooled state, and freezes at least a part of the liquid in the supercooled state.

Description

[0001] technology area [0002] Embodiments of the present invention relate to a substrate processing apparatus and a substrate processing method. Background technique [0003] In microstructures such as templates for imprinting, mask blanks for lithography, and semiconductor wafers, fine concavo-convex portions are formed on the surface of the substrate. [0004] Here, ultrasonic cleaning, two-fluid jet cleaning, and the like are known as methods for removing contaminants such as particles adhering to the substrate surface. However, when ultrasonic waves are applied to the substrate or a fluid is sprayed on the substrate surface, the fine unevenness formed on the substrate surface may be damaged. In addition, in recent years, the unevenness has become more likely to be damaged as the unevenness has been miniaturized. [0005] Then, as a method of removing contaminants adhering to the substrate surface, a freeze cleaning method has been proposed (for example, refer to Patent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/02B08B3/02
CPCB08B3/022H01L21/02041H01L21/67051H01L21/67109G03F7/40G03F7/422H01L21/02057H01L21/67248H01L21/67253H01L21/02052H01L21/6704H01L21/67098H01L21/68764B08B3/10B08B7/0092H01L22/12
Inventor 神谷将也出村健介松嶋大辅中野晴香伊万·彼得罗夫·加纳切夫
Owner SHIBAURA MECHATRONICS CORP