Wafer-level packaging light-emitting device with moisture barrier structure

Abstract

The invention proposes a chip-scale package light-emitting device. The chip-scale package light-emitting device at least comprises a blue-light LED chip and a light-emitting structure, wherein the light-emitting structure is arranged on the blue-light LED chip and comprises a first light-emitting layer and a second light-emitting layer, the first light-emitting layer is arranged on the second light-emitting layer and comprises a first high-molecule material and a non-humidity sensitive light-emitting material, the non-humidity sensitive light-emitting material is mixed in the first high-molecule material, the second light-emitting layer comprises a second high-molecule material and a humidity sensitive light-emitting material, and the humidity sensitive light-emitting material is mixed inthe second high-molecular material. Therefore, the first light-emitting layer has low moisture permeation rate, the permeation of moisture can be blocked, so that the moisture is difficult to permeatethrough the humidity sensitive light-emitting material, the moisture blocking performance of the light-emitting device can be improved, and the service lifetime of the light-emitting device can be prolonged.

Description

technical field [0001] The present invention relates to a light emitting device, in particular to a light emitting device having a moisture barrier structure and using an LED chip. Background technique [0002] LED (Light Emitting Diode) chips are commonly used to provide light sources for illumination, display or indication, and LED chips are usually placed in a package structure to become a light-emitting device, wherein the package structure may include a photoluminescence Materials (fluorescent materials or light conversion materials) to partially convert the light emitted by the LED chip (such as blue light) into other wavelengths (such as yellow light), and the light of different wavelengths is mixed to form white light. Depending on the application, the spectrum characteristics of the photoluminescent material to be selected are also different. [0003] For example, most current liquid crystal displays use LED light-emitting devices as backlight sources. In this appl...

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Problems solved by technology

[0007] The above-mentioned solutions for blocking moisture from the packaging structure are all aimed at bracket-type light-emitting devices. However, the use of brackets will increase the package size of the LED chip, and a thicker silica gel covering layer or more silica gel is used to improve the moisture barrier effect. It will further increase the overall size of the light-emitting device. Such a solution is not conducive to the application of LEDs to thin, light and small electronic products, such as LED backlights for mobile devices or TVs.

In order to meet the requirements of such applications, LED lighting devices must have a small size, and among the small-sized lighting devices that are constantly being introduced, chip-scale package (CSP) lighting devices have the most advantages and attract the most attention. However, , reducing the size of the LED package makes it more difficult to block external moisture. So far, the existing LED technology still has no good moisture barrier solution that can be applied to CSP light-emitting devices

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