Fully-automatic solder paste printing machine capable of sucking powder

Abstract

The invention provides a fully automatic solder paste printing machine capable of absorbing powder. The rotating angle of the scraper is designed to be adjustable, so that the scraper can meet different needs and at the same time absorb the residual powder of solder paste on the stencil. Remove the solder paste on the surface of the stencil, and secondly, recycle the solder paste raw materials, including the casing, clamping and lifting system, platform correction system, guide rail transportation system, stencil frame clamping system, scraper printing system and subsequent cleaning system, among which, The squeegee printing system includes a fixed frame, a through shaft and a scraper, and the stencil frame clamping system includes a stencil frame for clamping the stencil, and the stencil frame is used to absorb solder paste remaining on the stencil The powder suction part of the powder, the powder suction part includes a powder inlet, a powder storage channel for accumulating solder paste powder, and an opening and closing opening is arranged on the side of the powder storage channel.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a powder-absorbing fully automatic solder paste printing machine. Background technique [0002] The application of electronic products has penetrated into all aspects of life, and people's manufacturing requirements for electronic products are getting higher and higher, because electronic products are becoming smaller and more sophisticated, and the production of printed circuit boards (PCBs) of electronic products must be produced by surface mount technology (SMT) ) equipment, the solder paste printing of the first process of production is done by the solder paste printing machine, so the processing of the first process largely determines the production quality of printed circuit boards (PCB). At present, the solder paste printing of printed circuit boards (PCB) is mostly completed by semi-automatic solder paste printing machines or fully automatic solder pas...

AI Technical Summary

Problems solved by technology

At present, the solder paste printing of printed circuit boards (PCB) is mostly completed by semi-automatic solder paste printing machines or fully automatic solder paste printing machines, and is composed of multiple production systems. Each system cooperates with each other and completes its own tasks to ensure Integrity of circuit board printing, one of the most important links is the solder paste printing link. For example, the Chinese patent document with the application number CN201420229924.4 has announced the suspension scraper system of the automatic solder paste printing machine. In this technical solution In, "the front knife support shaft is equipped with a front knife limit block located above the front knife connecting plate" to realize "the suspended blade can automatically adapt to the surface of the steel mesh to ensure that the solder paste can be evenly printed on the PCB ", however, the height distance between the front knife connecting plate and the front knife limit block is too small, and because the distance is a fixed distance, the angle adaptability of the blade is not sufficient, and it cannot meet the deflection of a large angle

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