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Combined laser drilling and plasma etching method for producing micromechanical device, and micromechanical device

A technology of plasma etching and laser drilling, which is used in the manufacture of microstructure devices, microstructure devices without moving elements, jet devices, etc. problem, to achieve the effect of small channel openings

Active Publication Date: 2018-02-23
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that during laser drilling there is always the formation of dense smoke which can harm the MEMS structure
A further disadvantage is that the laser drilling process is not very selective for different materials

Method used

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  • Combined laser drilling and plasma etching method for producing micromechanical device, and micromechanical device
  • Combined laser drilling and plasma etching method for producing micromechanical device, and micromechanical device
  • Combined laser drilling and plasma etching method for producing micromechanical device, and micromechanical device

Examples

Experimental program
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Effect test

Embodiment Construction

[0024] figure 1 A prior art micromechanical device with a cavity with closed channels is shown. A micromechanical arrangement with a MEMS wafer 4 and a cap wafer 3 is schematically shown. The cap wafer 3 has an access channel 1 which is closed by means of a fusing seal 5 . The electrical contact area 2 is arranged in the slot of the cap wafer 3 . The micromechanical device has a first cavity 100 , which contains, for example, a rotation speed sensor, and a second cavity 200 , which contains, for example, an acceleration sensor. Cavity 200 essentially contains a combination of pressurized atmosphere and process gas when bonding MEMS wafer 4 and cap wafer 3 . This ensures good vibration damping of the acceleration sensor. The cavity 100 has been evacuated through the channel 1 and the channel 1 is then closed by means of the melting seal 5 . This ensures a high quality of the vibrator of the rotational speed sensor. The arrows mark the direction of action of the laser seal...

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Abstract

The invention relates to a micromechanical device. The micromechanical device is provided with a first substrate (11), at least one first cavity (100), and a closed channel (1) which is communicated to the first cavity (100), wherein the channel (1) penetrates through the first substrate (11) to extend. The essence of the micromechanical device is that the channel (1) has a laser drilled first section (12) and a plasma etched second section (13), wherein the plasma etched second section (13) has an opening to the first cavity (100); and the channel (1) is enclosed through a melt closure (5) formed by melt of the at least first substrate (11) in the first section (12). The invention also relates to a combined laser drilling and plasma etching method for producing the micromechanical device.

Description

technical field [0001] The invention relates to a micromechanical device with a first substrate, at least one first cavity, and a closed channel leading to the first cavity, wherein the channel extends through the first substrate. Background technique [0002] A method for targeted adjustment of the internal pressure in a cavity of a MEMS component is known from the document WO 2015 / 120939 A1. In this case, narrow access channels to the MEMS cavities are produced in the cap wafer or in the sensor wafer. The cavity is filled with the desired gas and the desired internal pressure via the inlet channel. Afterwards, the area surrounding the access channel is locally heated by a laser. Here, the substrate material liquefies locally and tightly seals the access channel when it solidifies. [0003] This method is mostly utilized when it is desired to generate different internal pressures in two cavities in a MEMS element having two cavities ( figure 1 ). [0004] This is neces...

Claims

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Application Information

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IPC IPC(8): B81B7/02B81B1/00B81C1/00B23K26/382
CPCB23K26/382B81B1/002B81B7/02B81C1/00087B81C1/00531G01C19/5628G01C19/5663G01C19/5769B23K1/0016B23K26/0661B23K26/26B23K26/324B23K26/402B23K26/0622B23K26/0624G01P15/0802B23K2101/42B81B7/0041B81C2203/0145
Inventor J-P·施塔德勒J·赖因穆特
Owner ROBERT BOSCH GMBH
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