Processing method of electrostatic agent for anti-electrostatic adhesive tape

Abstract

The invention discloses a processing method of an electrostatic agent for an anti-electrostatic adhesive tape. The processing method comprises the following steps: (1) weighing raw materials in partsby weight: 10 to 15 parts of meglumine, 5 to 10 parts of ceramic powder, 1 to 5 parts of nano stone needle powder, 1 to 5 parts of anionic polyacrylamide, 0.5 to 2 parts of polyvinyl alcohol, 0.5 to 2parts of sodium cocoyl glutamate, 0.1 to 1 part of sodium acetate and 0.05 to 0.5 part of hydrolyzed polymaleic anhydride; (2) adding the sodium cocoyl glutamate and the hydrolyzed polymaleic anhydride into the polyvinyl alcohol and heating to 110 DEG C to 120 DEG C; keeping heat and mixing for 10min to 15min to obtain a material I for later use; (3) uniformly mixing the ceramic powder and the nano stone needle powder and drying in a drying oven with the temperature of 120 DEG C to 125 DEG C for 10min to 13min; keeping the heat to obtain a material II for later use; (4) uniformly mixing the meglumine, the anionic polyacrylamide and the sodium acetate and heating to 85 DEG C to 125 DEG C; keeping the heat and mixing for 5min to 10min to obtain a material III for later use; (5) uniformly mixing the material I, the material II and the material III to obtain a finished-product electrostatic agent.

Description

Technical field: [0001] The invention relates to the technical field of adhesive tapes, in particular to a method for processing an electrostatic agent for an antistatic adhesive tape. Background technique: [0002] With the rapid development of electronic technology, the gradual reduction of the physical size of integrated circuits, the continuous improvement of integration, and the widespread use of more new polymer materials, electrostatic discharge has become increasingly important, and the problem of electrostatic protection has become more and more important. for widespread attention. So far, the FPC (abbreviation: flexible circuit board) manufacturing process is almost all processed by subtractive method (etching method). Usually, copper clad board is used as the starting material, and the resist layer is formed by photolithography, and the unnecessary parts are etched away. The copper surface of the circuit board is formed into a circuit conductor, and then the cove...

AI Technical Summary

Problems solved by technology

[0003] At present, some high-temperature resistant antistatic tapes on the market still have the following problems: (1) Introduce ionic additives into the interlayer between the adhesive layer and the substrate, and its electrostatic conductivity mainly depends on the humidity in the environment. In a high-temperature environment, it will not be able to Play a normal antistatic effect; (2) Introduce ionic additives into the adhesive layer, because these ionic additives will be in direct contact with the PI surface, and there is a risk of migrating from the adhesive layer to the adhesive layer surface and transferred to the PI surface, Contaminate the PI surface; (3) Introduce conductive metal particles or polymer particles into the adhesive. Although it can maintain the static conductive function itself, due to the introduction of these conductive particles, some properties of the adhesive itself will be affected. Such as reducing cohesive strength, wear resistance, acid and alkali resistance, etc.