Manipulator piece taking/placing method and device

Abstract

The embodiment of the invention provides a manipulator piece taking / placing method and device; the manipulator is applied to semiconductor epitaxial equipment; the method comprises the following steps: using a distance sensor to obtain a plurality of piece taking distance characteristic constants when the manipulator stretches into a preset position in a pallet, wherein the piece taking distance characteristic constant represents the distance between the distance sensor and different points on a wafer; using the piece taking distance characteristic constants and radius parameters to determinethe angle between a piece slot plane and the standard plane, wherein the standard plane refers to the plane formed by using a process chamber top surface as the reference; calculating a piece taking move down characteristic constant according to the angle; removing the wafer according to the piece taking move down characteristic constant, thus greatly improving the wafer placing success rate, andpreventing wafer press damages or manipulator press damages caused by technical personnel improper operations.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for picking up and placing a chip by a robot, and a device for taking and putting a chip by a robot. Background technique [0002] The silicon wafer used in the production of silicon semiconductor integrated circuits is called a wafer because of its circular shape. It can be processed into various circuit element structures on the wafer and become an IC product with specific electrical functions. [0003] In the wafer processing process, semiconductor epitaxial equipment, such as etching machine, PVD (physical vapor deposition, physical vapor deposition) equipment and CVD (chemical vapor deposition, chemical vapor deposition) equipment, are usually required. [0004] In the process of using these semiconductor epitaxy equipment for wafer processing, wafer placement and removal will be involved. Taking CVD equipment as an example, the prior wafer placement and remo...

AI Technical Summary

Problems solved by technology

[0007] During the process of placing and picking up wafers, the descending height of the manipulator 201 in the process chamber 203 is controlled by technicians. However, the technicians cannot see the relative positions of the manipulator 201 and the tray 204, so it is difficult to grasp in practical applications. If the descending height of the manipulator 201 is too small, it will result in the failure of wafer placement and pick-up. If the descending height is too large, the manipulator 201 will touch the tray 204, which will easily cause chipping and even damage the wafer. Circle and Manipulator 201

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