Solution bubble removal device and coating machine

Abstract

The invention provides a bubble removal device for a polyimide solution. The device comprises a first tank, a second tank and an ultrasonic generator, wherein the second tank is arranged in the firsttank; the ultrasonic generator is arranged on the first tank; the volume of the second tank is smaller than that of the first tank; a first containing chamber and a second containing chamber which arenot connected with each other are respectively formed in the first tank and the second tank; the first containing chamber is filled with water; the second containing chamber is filled with a solution; and a liquid outlet pipe, a liquid inlet pipe and an exhaust pipe communicated with the second containing chamber are respectively arranged on the second tank. The invention further provides a coating machine. The coating machine comprises the bubble removal device for the polyimide solution, wherein the liquid outlet pipe is connected with a solution pipeline of a coating nozzle; and the liquidinlet pipe is connected with a storage tank. Compared with the prior art, the bubble removal device for the polyimide solution is capable of removing bubbles in the polyimide solution, so that the bubble removal time can be shortened, and time needed by the process is greatly reduced.

Description

technical field [0001] The invention relates to a display panel production technology, in particular to a solution bubble removal device and a coating machine. Background technique [0002] A flexible display is a display device based on a flexible substrate. Since the flexible display device has the characteristics of rollability, wide viewing angle, and portability, it has broad application prospects and good market potential. At present, the substrate materials that can be used for flexible display include ultra-thin glass, plastic film and metal foil. [0003] Polyimide (PI) is a kind of polymer with imide repeating unit, which has the advantages of wide application temperature, chemical corrosion resistance, high strength and high insulation. As a special engineering material, PI has been widely used in aviation, aerospace, microelectronics and other fields. At present, PI as a flexible substrate material has been successfully applied to some flexible display electro...

AI Technical Summary

Problems solved by technology

[0006] At present, the commonly used methods to remove air bubbles in PI solution are: put the PI solution in a vacuum environment and keep vacuuming; but continuous vacuuming will cause the low boiling point organic solvent NMP (N-methylpyrrolidone) in the PI solution to volatilize and appear PI solid content deviation, abnormal film thickness, etc.; there is another method of continuously mechanically stirring the PI liquid for 16-18 hours, and passing clean nitrogen with bubbles, but this method takes a long time and cannot adapt to industrial quantities. production demand

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