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Fastening assembly with miniaturized electronic tag

A technology for fastening components and electronic tags, applied in the field of radio frequency, can solve the problem of temperature monitoring of components that cannot be fastened, and achieve the effects of high temperature monitoring accuracy, good metal resistance, and increased gain.

Pending Publication Date: 2018-03-20
HANGZHOU ZEJI ELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a fastening component with a miniaturized electronic label in order to overcome the problem that the existing technology cannot monitor the temperature of the fastening component

Method used

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  • Fastening assembly with miniaturized electronic tag
  • Fastening assembly with miniaturized electronic tag
  • Fastening assembly with miniaturized electronic tag

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Embodiment Construction

[0027] Such as Figure 1 to Figure 5 As shown, the fastening assembly with a miniaturized electronic tag provided in this embodiment includes a fastening assembly body 10 , a mounting part 20 and a miniaturized electronic tag 30 . The mounting member 20 is disposed at an end of the fastening assembly body 10 . The miniaturized electronic tag 30 is arranged on the mount 20. The miniaturized electronic tag 30 includes a miniaturized antenna 1a and a chip 1b connected to the power feeding part of the miniaturized antenna. The miniaturized antenna 1a includes a ceramic substrate 1, a radiation part 2, a reflector part 3 and connecting part 4. The radiation part 2 is formed on the first surface 11 of the ceramic substrate 1 . The reflection part 3 is formed on the second surface 12 of the ceramic substrate 1 . One end of the connecting portion 4 is electrically connected to the reflective portion 3, and the other end extends along the side wall of the ceramic substrate 1 to the ...

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Abstract

The invention provides a fastening assembly with a miniaturized electronic tag. The fastening assembly comprises a fastening assembly body, a mounting member and the miniaturized electronic tag. The mounting member is arranged at the end part of the fastening assembly body. The miniaturized electronic tag is arranged on the mounting member. The miniaturized electronic tag comprises a miniaturizedantenna and a chip connected with the feed part of the miniaturized antenna. The miniaturized antenna comprises a ceramic substrate, a radiation part, a reflection part and a connection part. The radiation part is formed on the first surface of the ceramic substrate. The reflection part is formed on the second surface of the ceramic substrate. One end of the connection part is electrically connected with the reflection part. The other end of the connection part extends along the sidewall of the ceramic substrate to the first surface of the ceramic substrate to form the feed part, wherein the feed part is between the other end and the radiation part and is electrically connected with the chip.

Description

technical field [0001] The invention relates to the field of radio frequency technology, and in particular to a fastening component with a miniaturized electronic label. Background technique [0002] At present, there are many nodes in the power system that need temperature monitoring. By monitoring the temperature of key power nodes, property losses and casualties caused by high temperature aging of these nodes can be avoided. Fastening components composed of bolts and nuts are widely used in power systems. The fastening components are often accompanied by high-temperature heating, which is an important hidden danger point. Therefore, real-time temperature monitoring of this node is very necessary. [0003] Bolts are usually composed of two parts: the bolt head and the bolt shank. According to the shape of the bolt head, it can be divided into hexagonal, round head and square head. At present, there are the following temperature measurement schemes for the fastening compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/14G01K7/00H01Q1/38H01Q1/50H01Q1/52H01Q19/10H01Q1/22G01K1/143
CPCH01Q1/2225H01Q1/38H01Q1/50H01Q1/52H01Q19/104G01K1/14G01K7/00
Inventor 汤兴凡徐超薛浩王涵
Owner HANGZHOU ZEJI ELECTRONICS TECH CO LTD
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