High efficiency heating and heat dissipation system
A heat dissipation system and high-efficiency technology, which is applied to laser parts, electrical components, lasers, etc., can solve the problems of low automation, high difficulty, and high structural design requirements, and achieve high efficiency, heat dissipation temperature control, and simple structure. Effect
Pending Publication Date: 2018-03-27
珠海市运泰利自动化设备有限公司
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Problems solved by technology
[0003] At the current chip production end, for small-sized chip products, due to technical and cost constraints at the front end of production and manufacturing, very few manufacturers will test the performance parameters of the chip in a real working environment; due to the low degree of automation of manufacturers' equipment, it is impossible to Test a large number of laser chip products; in addition, the contact-type high-precision temperature control technology in a small area requires extremely high structural design, and it is extremely difficult to realize the contact-type high-precision temperature control technology without causing damage to the product
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[0024] like Figure 1 to Figure 5 As shown, the specific embodiment of the present invention is: the present invention includes a carrier module 1, a temperature control module and a jacking module, the carrier module 1 is used to install the chip 5 to be tested with high precision, and the temperature control module is used for To achieve high-precision contact temperature control of microchips, the jacking module is used to drive the up and down displacement movement of the temperature control module, thereby providing a basis for realizing high-precision contact temperature control of microchips.
[0025] The carrier module 1 is fitted with an avoidance cavity 11 at the bottom where the chip 5 is installed, and the bottom of the chip 5 is partially exposed, but the chip 5 as a whole will not fall into the avoidance cavity 11 middle.
[0026] The temperature control module includes a temperature control module mounting block 21 and a semiconductor cooling plate 22 arranged ...
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The invention discloses a high efficiency heating and heat dissipation system which is simple and compact in structure, reasonable in design and capable of realizing high precision temperature controlon microchips. The high efficiency heating and heat dissipation system comprises a carrier module used for installation of a chip to be detected, a temperature control module including a temperaturecontrol module installation block and a semiconductor refrigerating sheet arranged on the temperature control module installation block, and a jacking module, wherein an upper end of the semiconductorrefrigerating sheet is provided with copper particles that are positioned below the chip; the jacking module comprises a jacking plate, the carrier module and the temperature control module are stacked on the jacking plate in an up and down manner, the jacking module is used for driving the temperature control module installation block to move p and down, the carrier module is provided with a collision avoidance cavity positioned on a bottom part of a chip installation zone in an adaptive manner, and the copper particles are in direct contact with the bottom part of the chip along the collision avoidance cavity when the jacking module is used for driving the temperature control module installation block to move up, The high efficiency heating and heat dissipation system can be applied toa technical field of temperature control of precision chip products.
Description
technical field [0001] The invention relates to a high-efficiency plus heat dissipation system. Background technique [0002] At present, many electronic components and optical components, such as common resistors, capacitors and chips, etc., their performance and parameters will be unstable under different temperature environments. In the process of automatic testing of infrared laser chip products, it is necessary to simulate the real working environment of the DUT DUT (Device Under Test). When chip products work normally, the chip itself will heat up. In order to obtain the real working environment of the DUT For functional parameters, the temperature of the product under test must be precisely controlled in real time in the automated test equipment. [0003] At the current chip production end, for small-sized chip products, due to technical and cost constraints at the front end of production and manufacturing, very few manufacturers will test the performance parameters ...
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Login to View More IPC IPC(8): H01S5/024
CPCH01S5/02415
Inventor 王刚
Owner 珠海市运泰利自动化设备有限公司