Grinding mat, grinding device and grinding mat manufacturing method

Abstract

The invention provides a high-conservation grinding mat. The grinding mat comprises a grinding layer which contains a macromolecular elastic main body and a plurality of titanium dioxide nanowires, and all the titanium dioxide nanowires are independent from one another and distributed in the macromolecular elastic main body at will. The invention further provides a grinding device and a grinding mat manufacturing method.

Description

technical field [0001] The invention relates to a high conservation polishing pad, a polishing device and a method for manufacturing the polishing pad. Background technique [0002] Grinding generally refers to the abrasion control of the initial rough surface in the chemical mechanical polishing (CMP) process. It uses the abrasive slurry containing fine particles to evenly disperse on the upper surface of the polishing pad, and at the same time, the substrate to be polished is pressed against the polishing pad. Rub in repeated regular movements. The substrate to be polished is such as semiconductor, storage media substrate, integrated circuit, flat glass of liquid crystal display, optical glass and photoelectric panel. During the grinding process, a grinding pad must be used to grind the substrate to be polished, so the quality of the grinding pad will directly affect the grinding effect of the substrate to be polished. [0003] refer to figure 1 , showing a schematic di...

AI Technical Summary

Problems solved by technology

However, the biggest problem with the polishing pad 2 is that when the resin 21 is poured into the circular mold barrel, it cannot be evenly and fully distributed in the circular mold barrel due to surface tension, and the size and distribution of these holes 22 will be caused during molding. different, and difficult to control, and then through the slicing process, the size of the hole 22 on the slicing surface of the polishing pad 2 will be more obvious

In addition, these holes 22 are not communicated with each other, which makes it difficult for the polishing liquid to circulate during use, and the polishing slurry cannot penetrate into the interior of the polishing pad during grinding, so that the conservation of the polishing liquid is low.

[0006] In addition, Taiwan Patent Publication No. 200609315 discloses a porous chemical mechanical polishing pad having pores filled with ingredients, the polishing pad comprises a polymeric material, which controls the pores of the polishing pad by confining the voids in the polymeric material matrix , while adding liquid, solid or mixture thereof to improve the polishing uniformity of the polishing pad, yet this method is not easy to control the size of the formed holes, and moreover the small holes on the surface of the polishing pad are easily blocked by polishing powder, and its The low retention of the grinding liquid may easily cause scratches on the substrate to be ground

[0007] Therefore, there is an urgent need to develop a novel grinding pad in the art to overcome the disadvantages of uneven foaming and low retention of grinding fluid in the aforementioned grinding pad, so as to improve the grinding effect.

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