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Quick testing method for opening/shortcircuit of high-density LED lamp diode product without inner positioning hole

A technology of LED lamp wick and detection method, applied in the direction of electronic circuit testing, measuring electricity, measuring device, etc., can solve the problems of normal mass production, inability to meet customer delivery, waste of processing time, etc., to achieve low production difficulty, low cost, The effect of high production efficiency

Inactive Publication Date: 2018-04-13
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, it wastes a lot of processing time and cannot meet the needs of customer delivery, which has led to the failure of normal mass production of such products.

Method used

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  • Quick testing method for opening/shortcircuit of high-density LED lamp diode product without inner positioning hole
  • Quick testing method for opening/shortcircuit of high-density LED lamp diode product without inner positioning hole

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Embodiment Construction

[0025] In order to enable those skilled in the art to better understand the technical solution of the present invention, the product of the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings.

[0026] Such as figure 1 and figure 2 As shown, a quick detection method for open and short circuits of high-density LED wick products without internal positioning holes, adding side strips 2 on the two short sides of the wick board 1, and designing positioning holes 3 on the side strips, so that there are no positioning holes The wick board 1 is transformed into a conventional test board that meets the test requirements, and then the wick board 1 is tested by using the general test method of the test board with positioning holes. The rapid detection method of the high-density non-internal positioning LED wick product of the present invention is based on the non-internal positioning PCB wick board 1 data provided by...

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Abstract

The invention discloses a quick testing method for opening / shortcircuit of high-density LED lamp diode product without an inner positioning hole. Edge strips are added on two corresponding short edgesof a diode board. Furthermore two positioning holes are designed on each edge strip. The diode board without the positioning hole is converted to a routine testing product which satisfies a testing requirement. Then a universal testing method is utilized for testing the electric performance of the LED diode testing board with the positioning holes. After testing, no-positioning profile fine-milling technology is utilized for successively milling the two added edge strips, thereby realizing electric performance testing for the high-density LED lamp diode without the inner positioning hole. Thequick testing method for the high-density LED lamp diode product has advantages of low production difficulty, low cost, high operability, high production efficiency, high quality, batch inputting into production, etc.

Description

technical field [0001] The invention relates to the technical field of manufacturing LED wick printed circuit boards, in particular to a rapid detection method for open and short circuits of high-density LED wick products without internal positioning holes. Background technique [0002] Compared with existing incandescent lamps or ordinary halogen light sources, LEDs and laser diodes have the advantages of fast response, small size, high brightness, long life, energy saving and environmental protection, and are the main development direction of future environmental protection and energy saving optoelectronic products. In order to ensure that there is no shadow in the LED light-emitting area, no via holes can be designed in the lamp bead panel area of ​​the LED wick board type printed circuit board, and the inner layer does not need to be designed with a copper skin layer. The solder pads of each lamp bead are evenly distributed in a matrix. Board surface. Since the entire b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2812G01R31/2818
Inventor 聂兴培卫雄樊廷慧吴世亮
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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