Alignment stability process for outer layer film design

Abstract

The invention discloses an alignment stability process for outer layer film design. The alignment stability process comprises the following steps of performing film manufacturing, alignment circle designing, verification circle designing, positioning hole drawing, film positioning hole forming, circuit board positioning hole forming, and film alignment and alignment detecting, wherein in the step1), the obtained three-dimensional data needs to satisfy dimensional and surface precision condition needed in growth amplification; in growth amplification, a two-dimensional model is subjected to transition and fusion treatment based on partial similarity of three-dimensional lines on a sample; the alignment circles of an alignment circle arrangement structure and verification circles of a verification circle arrangement structure are both linearly arranged; the alignment circles of the alignment circle arrangement structure and verification circles of the verification circle arrangement structure are both positioned on the linear initial positions; and in the step 7), for ensuring film alignment precision, expansion and shrinkage needs to be measured accurately on quadratic element. Theprocess has a simple structure, convenience in manufacturing, and capability of effectively improving film alignment precision and alignment speed and improving use convenience.

Description

technical field [0001] The invention relates to the technical field of film alignment, in particular to the design of an outer layer film alignment stabilization process. Background technique [0002] With the rapid development of electronic technology, electronic products are constantly developing in the direction of miniaturization and high reliability. Therefore, printed circuit boards used in electronic products are also developing in the direction of miniaturization and high density. Therefore, printed circuit boards The route on the board becomes finer, and the pads on the printed circuit board become denser. In this way, in the exposure process of the printed circuit board, the requirements for the alignment accuracy of the printed circuit board become more and more high. When the existing printed circuit board is exposed, the phenanthrene board is pasted on the surface of the printed circuit board and then exposed. Because the position between the phenanthrene board...

AI Technical Summary

Problems solved by technology

When the existing printed circuit board is exposed, the phenanthrene board is pasted on the surface of the printed circuit board and then exposed. Because the position between the phenanthrene board and the printed circuit board is sometimes inaccurate, the circuit after exposure is not as preset It is required to be printed on the surface of the printed circuit board to form a waste board, and the speed of affixing the film to the surface of the printed circuit board is slow and labor-intensive

Images