Device and method for achieving uniformity of electroless nickel plating layer

A technology of electroless nickel plating and uniformity, applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problems of uneven adhesion, concentration effect, slow progress, etc., to increase the degree of turbulence and achieve uniformity The effect of ensuring uniformity

Active Publication Date: 2018-04-24
HENGLI ELETEK
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AI Technical Summary

Problems solved by technology

This process is different from displacement plating in that the coating can be continuously thickened. During the process of continuous thickening of the coating, due to the uneven concentration of nickel ions in the electroless nickel plating bath, the nickel ions will be unevenly attached to the workpiece. Surfaces thus have an impact on product quality
In addition, the nickel ions in the electroless nickel plating tank are continuously consumed. When the concentration of nickel ions is lower than a certain level, the self-catalyzed redox reaction proceeds slowly, and the thickness and uniformity of the nickel plating layer on the surface of the workpiece will be affected.
In addition, the inhomogeneous temperature of the plating solution also affects the uniformity of the nickel plating layer. On the other hand, the nickel ions in the electroless nickel plating tank will continue to crystallize and adhere to the tank wall, which will also affect the concentration of nickel ions in the electroless nickel plating tank. influences

Method used

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  • Device and method for achieving uniformity of electroless nickel plating layer

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Embodiment Construction

[0017] Combine below figure 1 , the present invention is described in further detail.

[0018] A device for realizing the uniformity of electroless nickel plating layer, comprising an electroless nickel plating tank 10, an automatic dosing device 20 is arranged on the outside of the chemical nickel plating tank 10, and the dosing pipe of the automatic dosing device 20 is arranged on the electroless plating tank 10 The side wall of nickel tank 10, automatic dosing equipment 20 comprises the nickel ion concentration detection system that is arranged on electroless nickel plating tank 10 side walls, and nickel ion concentration detection system collects nickel ion concentration information and transmits by being placed in the sampling tube in plating bath To the PLC control system on the automatic dosing equipment 20, the dosing pump on the automatic dosing equipment 20 is controlled by the PLC control system to add medicine to the chemical nickel plating tank 10, and the describ...

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Abstract

The invention relates to a device and method for achieving the uniformity of an electroless nickel plating layer. The device comprises an electroless nickel plating tank, an automatic chemical addingapparatus is arranged on the outer side of the electroless nickel plating tank, a chemical adding tube of the automatic chemical adding apparatus is arranged on the side wall of the electroless nickelplating tank, and a stirrer is arranged in the electroless nickel plating tank. The method includes the following steps that 1, after the electroless nickel plating tank prepares a plating solution,the stirrer is started and a filter pump is started; 2, the tank wall of the electroless nickel plating tank is provided with an anode protection device; 3, a work piece is fed into the work area of the electroless nickel plating tank, nickel plating is started, and at the same time, the automatic chemical adding apparatus is started to maintain the concentration of the main salt of the bath solution. The device and method can provide the uniformity of the temperature and concentration in the electroless nickel plating tank so that the concentration of each component of the electroless nickelplating solution can be maintained in the normal process range, thus the uniformity of the electroless nickel plating layer is achieved.

Description

technical field [0001] The invention relates to the field of electroless nickel plating, in particular to a device and method for realizing the uniformity of the electroless nickel plating layer. Background technique [0002] Electroless nickel plating is a process in which a Ni-P or Ni-B composite coating is deposited on the surface of the workpiece through an autocatalytic oxidation-reduction reaction using the electroless nickel plating method. This process is different from displacement plating in that the coating can be continuously thickened. During the process of continuous thickening of the coating, due to the uneven concentration of nickel ions in the electroless nickel plating bath, the nickel ions will be unevenly attached to the workpiece. Surfaces thus have an impact on product quality. In addition, the nickel ions in the electroless nickel plating tank are continuously consumed. When the concentration of nickel ions is lower than a certain level, the self-cata...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/32C23F13/02
CPCC23C18/32C23F13/02
Inventor 季宏飞赵永徐小敏吴晓伟周杨
Owner HENGLI ELETEK
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