A kind of preparation method of photoresist board, chip module and photoresist board
A technology of photolithography plate and photoresist layer, which is applied to the photolithography process of the pattern surface, the original for photomechanical processing, optics, etc., can solve the problems of insufficient exposure and overexposure of photoresist, and achieve a solution Underexposure or overexposure, the effect of improving performance and yield
Active Publication Date: 2021-09-17
NANTONG FUJITSU MICROELECTRONICS
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[0004] The technical problem mainly solved by the present invention is to provide a preparation method of a photoresist plate, a chip module and a photoresist plate, which can effectively solve the problem of insufficient or overexposure of photoresist, and improve the performance and yield of the chip
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the ...
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The invention discloses a photoresist plate, a chip module and a preparation method of the photoresist plate. The preparation method of the photoresist plate includes: providing a substrate, the substrate includes a light-shielding area and a fully light-transmitting area, and the light-shielding area is adjacent to the fully light-transmitting area Setting; a filter film is set on the fully transparent area located in the preset area, so as to set the fully transparent area located in the preset area as a partially transparent area; wherein, the partially transparent area is used to filter at least one waveband ultraviolet light. Through the above method, the present invention can effectively solve the problem of insufficient or overexposure of the photoresist, and improve the performance and yield of the chip.
Description
technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a preparation method of a photoresist plate, a chip module and a photoresist plate. Background technique [0002] With the development of technology and the continuous expansion of application fields, electronic devices of semiconductor components occupy an increasingly important position in modern electronic technology. The manufacturing process of electronic devices of semiconductor elements includes an exposure step. In the exposure step, the semiconductor chip needs to be coated with a photoresist, and ultraviolet rays or excimer lasers are irradiated onto the semiconductor chip through a photoresist. In the prior art, the photoresist plate used in the exposure step is integrated, and the light transmission properties of the light-transmitting regions on the photoresist plate are completely consistent. [0003] In the long-term research and developm...
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IPC IPC(8): G03F1/80
CPCG03F1/80
Inventor 吴谦国
Owner NANTONG FUJITSU MICROELECTRONICS