Low-pressure injection molding method for power capacitor shell

A power capacitor and low-pressure injection molding technology, applied in the field of capacitors, to achieve the effect of good elasticity and high qualified rate of finished products

Active Publication Date: 2018-05-01
HUANGSHAN SHENGE ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are few related studies on the method or process of low-pressure injection molding of power capacitor shells.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The isotactic polypropylene homopolymer, modified waste plastic shell powder, talcum powder, silicon micropowder, fluororubber, nucleating agent, and antioxidant are in a mass ratio of 100:20:6:3:0.12:1.5:0.3 After weighing, place them in a mixer and mix them uniformly to make a mixture, wherein the antioxidant is a hindered phenolic antioxidant, and the nucleating agent is a metal compound of aliphatic carboxylic acid; the mixture is placed in the low pressure injection molding machine In the hopper, set the temperature of each zone of the screw of the low-pressure injection molding machine to 220~235°C, set the temperature of the mold in the low-pressure injection molding machine to 70~80°C, and the mixture in the hopper of the low-pressure injection molding machine is melted and plasticized by each zone of the screw before injection molding into the cavity of the mold, where the melting rate is 30~40cm 3 / s, the melt pressure is 52~58bar; the glue is injected in sequ...

Embodiment 2

[0022] The isotactic polypropylene homopolymer, modified waste plastic shell powder, talcum powder, silicon micropowder, fluororubber, nucleating agent, and antioxidant are in a mass ratio of 100:22:6.6:3.4:0.13:1.6:0.35 After weighing, place them in a blender and mix them uniformly to make a mixture, wherein the antioxidant is made by mixing a hindered phenolic antioxidant and a phosphite according to a mass ratio of 1:1, and the nucleating agent is fat Carboxylic acid metal compound; put the mixture into the hopper of the low-pressure injection molding machine, set the temperature of each zone of the screw of the low-pressure injection molding machine to 220~235°C, set the temperature of the mold in the low-pressure injection molding machine to 70~80°C, and perform low-pressure injection molding The mixture in the machine hopper is melted and plasticized in each area of ​​the screw, and then injected into the cavity of the mold. The melting rate is 30~40cm 3 / s, the melt pre...

Embodiment 3

[0026]The isotactic polypropylene homopolymer, modified waste plastic shell powder, talcum powder, silicon micropowder, fluororubber, nucleating agent, and antioxidant are in a mass ratio of 100:25:7:4:0.15:1.7:0.36 After being weighed, they are placed in a mixer and mixed uniformly to make a mixture, wherein the antioxidant is sulfide, and the nucleating agent is a metal compound of fatty carboxylic acid; the mixture is placed in a hopper of a low-pressure injection molding machine, and the The temperature of each zone of the screw of the low-pressure injection molding machine is set to 220~235°C, and the temperature of the mold in the low-pressure injection molding machine is set to 70~80°C. Cavity, where the melt rate is 30~40cm 3 / s, the melt pressure is 52~58bar; the glue is injected in sequence according to the time period, and the injection rate is 39.5~41.3cm 3 / s, the injection pressure is 86~95bar, the injection is divided into 6 sections for injection, and the time...

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Abstract

The invention relates to a low-pressure injection molding method for a power capacitor shell. The low-pressure injection molding method comprises the following steps of: sequentially putting isotaticpolypropylene homopolymer, modified waste plastic shell powder, talcum powder, silicon micro powder, fluororubber, a nucleating agent and an antioxidant into a mixer to uniformly mix to obtain a material mixture; and putting the material mixture into a hopper of a low-pressure injection molding machine, melting and plastifying the material mixture in the hopper of the low-pressure injection molding machine in each region of a screw, injection-molding the material mixture into a mould cavity of a mould, injecting glue in sequence according to a time quantum, opening the mould after mould cooling, ejecting and taking out products. According to the low-pressure injection molding method disclosed by the invention, modified waste plastic shell powder is utilized to substitute part of isotatic polypropylene homopolymer, so that recycling of a waste polypropylene capacitor shell is realized, and therefore, the low-pressure injection molding method is energy-saving and environmentally friendly, does not reduce elasticity and bending resistance of finished products, and further enables a qualification rate of the finished products to be 98.5%.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a low-pressure injection molding method for a power capacitor casing. Background technique [0002] Power capacitors, capacitors used in power systems and electrical equipment. Any two metal conductors separated by an insulating medium form a capacitor. The size of the capacitance of the capacitor is determined by its geometric size and the characteristics of the insulating medium between the two plates. When the capacitor is used under AC voltage, its reactive power is often used to represent the capacity of the capacitor. [0003] The shells in traditional power capacitors are generally plastic or aluminum shells, and most of the plastic shells are made of ABS plastics, polypropylene and other polymers through extrusion machines. The extruder is an important plastic machine, and the production and manufacture of most plastic products can be realized by extrusion molding. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/00B29B13/10C08L23/12C08L27/12C08L61/34C08L63/00C08K13/02C08K3/34C08K3/36C08K5/098C08K5/13B29L31/34
CPCB29B13/10B29C45/0001B29L2031/34C08L23/12C08L2205/025C08L2205/035C08L27/12C08L61/34C08L63/00C08K13/02C08K3/34C08K3/36C08K5/098C08K5/13Y02P20/10
Inventor 李先俊张宏远
Owner HUANGSHAN SHENGE ELECTRONICS TECH
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