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opc correction method

A processing method and graphics technology, applied in the direction of instruments, components used for optomechanical processing, optics, etc., can solve the problems of increasing the number of hot spots, reducing the size of graphics, consuming a lot of OPC engineer's time and OPC computing time, etc., to save time, The effect of removing the number of hotspots

Active Publication Date: 2021-08-13
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] It can be seen from the above that the processing of hotspots in the existing method needs to consume a lot of OPC engineer time, a lot of OPC computing time and a lot of software and hardware resources, and with the improvement of integration and the reduction of graphic size, the number of hotspots will increase

Method used

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Embodiment O

[0061] Such as figure 1 Shown is the flowchart of the OPC correction method of the embodiment of the present invention; the OPC correction method of the embodiment of the present invention comprises the following steps:

[0062] Step 1. Taking the hotspot patterns appearing in the OPC-corrected mask layout as known hotspot patterns and summarizing the known hotspot patterns.

[0063] Such as Figure 2A Shown is the layout of the known hotspot graphics corresponding to the first short-circuit hotspot; Figure 3A Shown is the layout of the known hotspot graphics corresponding to the second short-circuit hotspot; Figure 4A As shown in , it is the layout of the known hotspot graphics corresponding to the connection error hotspots of the upper and lower layers; Figure 5A Shown is the layout of known hotspot graphics corresponding to open circuit hotspots; the steps of inducing and summarizing the known hotspot graphics include:

[0064] Classify and determine the parameters o...

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Abstract

The invention discloses an OPC correction method, comprising steps: step 1, summing up and summarizing known hotspot graphics; step 2, summarizing and summarizing the processing method of known hotspot graphics; step 3, formulating known hotspots Identification rules for graphics and potential hotspot graphics; step 4, formulate preprocessing rules for preprocessing known hotspot graphics and potential hotspot graphics; step 5, identify known hotspot graphics and potential hotspot graphics for the newly designed mask template layout , performing preprocessing on the identified known hotspot patterns and potential hotspot patterns, and performing OPC correction on the preprocessed newly designed mask layout. The invention can reduce or eliminate the number of hot spots after OPC correction, thereby saving OPC engineer time, OPC computing time and software and hardware resources.

Description

technical field [0001] The invention relates to a semiconductor integrated circuit manufacturing method, in particular to an optical proximity correction (Optical Proximity Correction, OPC) correction method. Background technique [0002] In the photolithography process of semiconductor integrated circuits, the graphic structure of the circuit is first defined on the mask layout, and then the graphic structure on the mask layout is transferred to the photoresist formed on the surface of the wafer by photolithography to form a photolithographic process. glue graphics. During the photolithography process, when the size of the pattern and the size of the wavelength of the lithography are close to or even smaller, the pattern exposed on the photoresist and the pattern on the mask template will be caused by light interference, diffraction and development. Inconsistency results in distortion of the Optical Proximity Effect (OPE). Therefore, in order to form the required pattern ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/398G03F1/36
CPCG03F1/36G06F30/398
Inventor 王丹毛智彪于世瑞
Owner SHANGHAI HUALI MICROELECTRONICS CORP