led light and led packaging process

Abstract

The invention relates to an LED lamp and an LED packaging technology. The packaging technology comprises the steps of selecting an LED chip; welding the LED on heat sink (21) and arranging the heat sink (21) on a bracket; and forming multiple silica gel layers on the LED chip to achieve packaging of the LED chip, wherein the silica gel layer, in contact with the LED chip, in the multiple silica gel layers does not contain fluorescent powder. According to the LED packaging technology, the fluorescent powder is separated from the LED chip, so that the problem that the quantum efficiency of the fluorescent powder is reduced due to high temperature is solved; and silica gel in contact with the LED chip is high-temperature resistant silica gel, so that the problem that the light transmittance is reduced due to ageing and yellowing of the silica gel is solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an LED lamp and an LED packaging process. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The practicality and commercialization of high-performance LEDs have brought about a new revolution in lighting technology. The pixel light composed of multiple ultra-high-brightness red, blue, and green LEDs can not only emit various colors of light with continuously adjustable wavelengths, but also emit white light with a brightness of tens to one hundred candlepower as a lighting source. For incandescent lamps and LED solid-state lighting lamps with the same luminance, the power consumption of the latter only accounts for 10%-20% of the former. [0003] Most of the white LEDs currently produced are made by covering a layer of light yellow phosphor co...

AI Technical Summary

Problems solved by technology

[0004] LEDs that use the above method to emit light have the following defects: the distribution of light emitted by the LED light source is relatively scattered, and the illumination brightness of the light source is not good. It often needs to be shaped by an external lens to meet the brightness requirements, which greatly increases the production cost of the LED; The powder is directly coated on the surface of the chip, and the chip absorbs the scattered light, which reduces the luminous efficiency. Moreover, the high temperature of the chip will reduce the quantum efficiency of the phosphor powder, which will affect the lumen efficiency of the LED light source, which will easily lead to a decrease in light intensity. A series of problems such as spectral shift and accelerated aging of the chip reduce the service life of the LED light source

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