A method for manufacturing a blind via plate with high requirements for interlayer alignment

A manufacturing method and blind hole board technology, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, and electrical connection formation of printed components, etc., can solve the problems of increasing equipment flow, low yield rate, and increasing cost, and achieve increased facility flow, The effect of reducing cost increase, increasing cost

Active Publication Date: 2020-07-10
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As the process requirements of circuit products become higher and higher, the requirements for alignment between layers of blind hole boards are higher. For the production of such boards, the industry adopts the production of graphics and hole position targets and the production of targets on the sub-layer of the circuit board. , first make graphics and hole targets on each layer of PCB circuit, and then use a punching machine to identify and shoot the hole target on the above-mentioned PCB circuit board with graphics, and punch out the target for the other layer of circuit The holes are aligned, but the punched target holes are not particularly correct, which will cause another layer of alignment
Make the target on the sub-layer of the circuit board, remove the copper foil and insulating layer covering the sub-layer target after lamination, expose the sub-layer target for alignment, use the above-mentioned sub-layer target for blind hole docking and window opening, and perform laser drilling hole, increase the equipment flow, increase the cost, and the yield rate is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for manufacturing a blind hole plate with high requirements for interlayer alignment, the manufacturing steps are as follows:

[0021] Step S1, cutting the baking board: cut the board according to the product specification and bake it at 150°C for 2 hours to obtain the circuit board substrate;

[0022] Step S2, drilling the circuit board substrate: the circuit board substrate is divided into an inner layer circuit board substrate and an outer layer circuit board substrate, and the inner layer circuit board substrate is respectively drilled with blind holes, inner peripheral target holes, inner layer Positioning holes and inner layer alignment holes, the inner layer alignment holes are provided with 4, the diameter of the inner layer alignment holes is 1.5mm, and the outer layer circuit board substrate is respectively drilled with outer peripheral target holes and outer layer positioning holes and the outer layer alignment holes, the outer layer alignment holes ...

Embodiment 2

[0028] A method for manufacturing a blind hole plate with high requirements for interlayer alignment, the manufacturing steps are as follows:

[0029] Step S1, cutting the baking board: cut the board according to the product specification and bake it at 160°C for 1.5 hours to obtain the circuit board substrate;

[0030] Step S2, drilling the circuit board substrate: the circuit board substrate is divided into an inner layer circuit board substrate and an outer layer circuit board substrate, and the inner layer circuit board substrate is respectively drilled with blind holes, inner peripheral target holes, inner layer Positioning holes and inner layer alignment holes, the inner layer alignment holes are provided with 5, the diameter of the inner layer alignment holes is 2mm, and the outer layer circuit board substrate is respectively drilled with outer layer peripheral target holes, outer layer positioning holes and There are 5 outer layer alignment holes, the diameter of the o...

Embodiment 3

[0036] A method for manufacturing a blind hole plate with high requirements for interlayer alignment, the manufacturing steps are as follows:

[0037] Step S1, cutting the baking board: cut the board according to the product specification and bake it at 140°C for 2.5 hours to obtain the circuit board substrate;

[0038] Step S2, drilling the circuit board substrate: the circuit board substrate is divided into an inner layer circuit board substrate and an outer layer circuit board substrate, and the inner layer circuit board substrate is respectively drilled with blind holes, inner peripheral target holes, inner layer Positioning holes and inner layer alignment holes, the inner layer alignment holes are provided with 4, the diameter of the inner layer alignment holes is 1mm, and the outer layer circuit board substrate is respectively drilled with outer peripheral target holes, outer layer positioning holes and Outer layer alignment holes, the outer layer alignment holes are pro...

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PUM

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Abstract

The invention discloses a method for manufacturing a blind hole board having high requirements for interlayer alignment. The manufacturing method comprises the steps of S1, cutting and baking a board;S2, drilling a circuit board substrate; S3, manufacturing a blind hole layer; S4, laminating inner circuits; and S5, manufacturing outer circuits. According to the invention, a problem of layer deviation is reduced through improving the alignment degree between inner circuit board substrates, the cost increase caused by additionally arrangement of equipment in the manufacturing process is reduced, and the quality and yield are improved through improving the accuracy of interlayer alignment.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing blind hole boards with high requirements for interlayer alignment. Background technique [0002] As the process requirements of circuit products become higher and higher, the requirements for alignment between layers of blind hole boards are higher. For the production of such boards, the industry adopts the production of graphics and hole position targets and the production of targets on the sub-layer of the circuit board. , first make graphics and hole targets on each layer of PCB circuit, and then use a punching machine to identify and shoot the hole target on the above-mentioned PCB circuit board with graphics, and punch out the target for the other layer of circuit The holes are aligned, but the punched target holes are not particularly correct, which will cause another layer of alignment deviation. Make the target on the sub-layer of the ci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/46H05K3/40
CPCH05K1/0266H05K1/115H05K3/40H05K3/4611H05K2203/0214
Inventor 刘敏李敬虹贺超陈春白建国
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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