Megasonic electroplating device for improving metal microelectroforming uniformity and method

Abstract

The invention provides a megasonic electroplating device for improving metal microelectroforming uniformity and a method. Bi-directional alternate megasonic waves are coupled in the electroplating process. The device comprises a megasonic plating tank, and the megasonic plating tank comprises piezoelectric ceramic groups, an electroplating tank, a waterproof tank and a water bath; the electroplating tank is fixed in the waterproof tank by sticking to the wall; the waterproof tank is positioned in the water bath and is fixed to the water bath through an upper cover plate which is integral withthe waterproof tank; the piezoelectric ceramic groups are pasted outside the two side walls of the electroplating tank; the electroplating tank is made from a quartz material; the wall thickness of the electroplating tank is the half-wave length of utilized megasonic frequency in quartz; and megasonic signals are introduced into the piezoelectric ceramic groups, and time control of bi-directionalmegasonic vibration is achieved. The method for improving metal microelectroforming uniformity of the megasonic electroplating device comprises the steps that a photoresist microstructure is manufactured on a substrate, and glue film imaging is achieved; and bi-directional alternate megasonic wave irradiation is applied during the electroplating process. According to the megasonic electroplating device and the method, operation is easy and feasible, and uniformity of a plating during the metal microelectroforming process can be effectively improved.

Description

technical field [0001] The invention belongs to the technical field of micro-manufacturing, and relates to a megasonic electroforming device and an electroforming method, in particular to a megasonic electroforming device and a method for improving the uniformity of metal micro-electroforming. Background technique [0002] As the mainstream process of metal micromanufacturing, electroforming technology is often used to manufacture parts with complex shapes that are difficult or costly to manufacture by traditional machining methods because of its high replication accuracy and repeatability. With the development of micro-nano technology, the demand for micro-metal devices continues to increase. In the electroforming process of metal micro-devices, the edge effect of the current will cause the electric field lines to easily concentrate at the corners, and the metal micro-devices after electroforming often have the problem of uneven casting layer thickness in the edge area and ...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above technical problems, the present invention provides a megasonic electroforming equipment and method for improving the uniformity of metal micro-electroforming, which introduces megasonic wave energy into the micro-electroforming process in a certain way, and improves the micro-electroforming process. The electroforming uniformity is used to solve the problem of uneven thickness of the casting layer in the metal microstructure electroforming process, improve the dimensional accuracy of the electroforming process, and improve the electroforming ability

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