Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for manufacturing shield printed wiring board

A manufacturing method and wiring board technology, applied in the direction of printed circuit manufacturing, magnetic/electric field shielding, printed circuit, etc., can solve problems such as errors of surrounding electronic machines

Inactive Publication Date: 2018-05-11
TATSUTA ELECTRICWIRE & CABLE
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, if there is no electromagnetic wave shielding layer, electromagnetic waves will leak from the wiring circuit to the surroundings, and the electromagnetic waves will cause errors in the surrounding electronic equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing shield printed wiring board
  • Method for manufacturing shield printed wiring board
  • Method for manufacturing shield printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach １

[0035] First, based on figure 1 A method of forming a desired pattern shape made of a metal thin film according to Embodiment 1 will be described. In this case, the desired shape of the metal film is produced on the simple sheet 1 instead of on the printed wiring board.

[0036] First, sheet 1 on which a figure shape is to be formed is prepared. The sheet 1 is made of, for example, a synthetic resin such as polyimide or polyester. Next, the resist 2 is loaded on the sheet 1 in a certain pattern. As the resist 2, the water-soluble resist described in Patent Document 4 can be used. For example, an aqueous resist solution is placed on the sheet 1 in a predetermined pattern by mask printing and dried.

[0037] Then, a metal layer 3 is provided over the resist 2 and the portion of the sheet 1 not loaded with the resist 2 . That is, the metal layer 3 is provided on the entire surface of the sheet 1 on which the resist 2 is carried. The metal type of the metal layer 3 is not par...

Embodiment approach ２

[0069] FIG. 8 shows a shielded printed wiring board including a shielding layer according to the second embodiment. Embodiment 2 differs from Embodiment 1 in that the conductive adhesive layer 40 is provided on the printed wiring board main body 10 , and is the same as Embodiment 1 except for that. Embodiment 2 also has the same effects as Embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

This method for manufacturing a shield printed wiring board includes: a step for preparing a printed wiring board body having a base substrate, a ground wiring provided on the base substrate, and an insulating layer covering the ground wiring and being provided with an opening so that a part of the ground wiring is exposed; a resist placement step for placing a resist resin in a predetermined pattern shape on the insulating layer; a metal layer formation step for providing a metal layer on the ground wiring exposed through the opening and on the printed wiring board body on which the resist resin is placed; and a step for removing the resist resin using a solvent, whereby the portion of the metal layer provided on the resist resin is removed along with the resist resin, and the metal layerpresent on portions other than the predetermined pattern shape is formed as a shield layer.

Description

technical field [0001] The invention relates to a manufacturing method of a shielded printed wiring board. Background technique [0002] Conventionally, an electromagnetic wave shielding layer is provided on a printed wiring board to shield electromagnetic waves generated from a circuit formed by wiring. For small electronic devices such as mobile phones and digital cameras, as the screen area increases, the transmission frequency of wiring circuit signals also tends to increase. In this way, if there is no electromagnetic wave shielding layer, electromagnetic waves will leak from the wiring circuit to the surroundings, and the electromagnetic waves will cause errors in the surrounding electronic equipment. Therefore, it is important to provide an electromagnetic wave shielding layer so that electromagnetic waves do not leak from the wiring circuit. [0003] Moreover, as electronic equipment is miniaturized, the development of printed wiring boards is also developing in th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/02H05K1/02H05K9/00
CPCH05K1/02H05K3/02H05K9/00H05K1/0218H05K3/064H05K3/14
Inventor 角浩辅桥本和博森元昌平田岛宏渡边正博山内志朗
Owner TATSUTA ELECTRICWIRE & CABLE