Thick film resistor slurry

Abstract

The invention discloses a thick film resistor slurry, and further provides a thick film resistor slurry with a resistance range of 0.1-10 M[omega]/, and a preparation method thereof. According to thepresent invention, the thick film resistor slurry with the any resistance between the adjacent resistances can be obtained by mixing nine thick film resistor slurries with the adjacent resistances of0.1 [omega]/, 1 [omega]/, 10 [omega]/, 100 [omega]/, 1 k[omega]/, 10 k[omega]/, 100 k[omega]/, 1 M[omega]/ and 10 M[omega]/ in the range of 0.1 [omega]/ to 10 [omega]/, the mixture of the slurries with the adjacent resistances has the good mixing performance, the electrical performance cannot be deteriorated after the mixing, and the resistor slurry obtained by mixing the resistor slurries with the adjacent resistances according to the any ratio does not contain the middle-range transition section so as to greatly reduce the production cost.

Description

technical field [0001] The invention relates to a resistance paste, in particular to a thick film resistance paste. Background technique [0002] As the raw material for the production of chip resistors, thick film resistor paste requires a wide range of resistance values, which can meet the needs of producing 0.1Ω~10MΩ resistance value chip resistors. Existing resistance pastes are divided by resistance value, and each order of magnitude is a grade, and the target resistance value is obtained by mixing adjacent resistance grades in different proportions. [0003] The current problems of thick film resistor paste in the production process of chip resistors are: [0004] 1) The electrical properties (EDS, size effect) of certain resistance grades will deteriorate after mixing, and in order to meet the performance requirements of sheet resistance, the process conditions for subsequent processing after mixing are more stringent, such as at 820 ~ 880 ° C, The TCR (temperature ...

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Problems solved by technology

[0004] 1) The electrical properties (EDS, size effect) of certain resistance grades will deteriorate after mixing, and in order to meet the performance requirements of sheet resistance, the process conditions for subsequent processing after mixing are more stringent, such as at 820 ~ 880 ° C, The TCR (temperature coefficient of resistance) of adjacent resistance files can be maintained at ±100ppm, and after mixing, the TCR will exceed 100ppm or even reach 400ppm under the same conditions;

[0005] 2) A good resistance curve cannot be obtained after some adjacent resistance files are directly mixed, so there are often intermediate resistance files, which will lead to an increase in cost

[0006] The reason for the above problems is: due to the order of magnitude difference in the resistance value of adjacent resistance value files, the following methods are generally adopted for each order of magnitude increase in resistance value: 1. Reduce the content of powder with high conductivity in the system; 2. Use a conductive phase with lower conductivity or reduce the ratio of the conductive phase; 3. Reduce the content of the total conductive phase in the system and increase the amount of glass; 4. Increase the content of glass that can increase the resistance value in the components; to ensure The electrical properties, the ratio of the conductive phase, the glass phase, and the composition of the glass phase must be within a certain range, and the two adjacent conductive phases and glass phases are quite different, so when mixed, the electrical properties will deteriorate.

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