Processing technology of deep narrow grooves on electrostatic chuck

Abstract

The invention discloses a processing technology of a deep narrow groove on an electrostatic chuck. The technology comprises steps that S1, parameters of a deep narrow groove are determined; S2, computer software modeling is carried out; S3, programming operation is carried out; S4, a post-processing program is generated; and S5, the deep narrow groove is processed. The technology is advantaged inthat parameter design is reasonable, in combination with the reasonable processing tool path, not only can the tool engage and retract frequency be reduced, the tool is protected, but also processingprecision and surface fineness are improved, and later sulfuric acid hard oxidation and the breakdown resistance test are facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a high-precision and high-efficiency processing technology for deep and narrow grooves on an electrostatic chuck. Background technique [0002] The electrostatic chuck is a device that uses electrostatic attraction to fix the wafer on the chuck and can increase the effective processing area of ​​the wafer and realize temperature control. It is a key component. The manufacturing process of integrated circuit chips is a highly automated assembly line operation Process, processing technology, especially plasma etching (ETCH), physical vapor deposition (PVD) and chemical vapor deposition (CVD), etc., are mostly completed in the reaction chamber, and the front and rear processes are closely connected, whether each process can be smooth The process will directly affect the production efficiency of the whole process, and when the wafer is processed in the reaction ch...

AI Technical Summary

Problems solved by technology

[0002] The electrostatic chuck is a device that uses electrostatic attraction to fix the wafer on the chuck and can increase the effective processing area of ​​the wafer and realize temperature control. It is a key component. The manufacturing process of integrated circuit chips is a highly automated assembly line operation Process, processing technology, especially plasma etching (ETCH), physical vapor deposition (PVD) and chemical vapor deposition (CVD), etc., are mostly completed in the reaction chamber, and the front and rear processes are closely connected, whether each process can be smooth The process will directly affect the production efficiency of the whole process, and when the wafer is processed in the reaction chamber, it is usually necessary to fix the wafer by means of a mechanical chuck and a vacuum chuck. The design of the electrostatic chuck is very compact, and its space utilization The requirements are high, there are many deep and narrow grooves that are difficult to machine, and sulfuric acid hard oxidation treatment is required in the grooves, and the surface finish of the grooves is high. The required roughness cannot be achieved by wire cutting and EDM. To pass the breakdown resistance test, milling cutters are required for processing. The problem of milling cutter breakage often occurs when using traditional processes. A new processing technology is needed to solve this problem.

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