Method for manufacturing electrode of HIT solar cell

Abstract

The invention discloses a method for manufacturing an electrode of an HIT solar cell. The method includes a silicon wafer used for manufacturing the solar cell, a layer of transparent conductive oxidation film is deposited on the surface of the silicon wafer, and the specific manufacturing process is as follows: first a punctiform sizing agent A is printed in an area of main grids and fine grids for manufacturing the electrode on the reverse side of the silicon wafer for manufacturing an electrode; then a sizing agent B is printed above the sizing agent A; afterwards, the steps of S1 and S2 are repeated on the front side of the silicon wafer; and finally, the silicon wafer is put in a curing oven of 100 DEG C to 200 DEG C to be cured for 20 to 40 min. Through the method provided by the invention, metal sizing agents required for manufacturing the electrode can be greatly saved, and welding tension of the electrode can be improved at the same time.

Description

technical field [0001] The invention belongs to the field of solar cell manufacturing, and in particular relates to an electrode manufacturing method of a HIT solar cell. Background technique [0002] The structure of the existing HIT solar cell, because the electrode of the HIT solar cell is directly deposited on the surface of the flattened conductive transparent conductive oxide film of the silicon wafer, so compared to other solar cells, the electrode of the HIT solar cell Since it protrudes from the surface of the silicon wafer and is not protected, it is relatively more prone to breakage or damage. [0003] Due to the low temperature process conditions of the HIT battery, the HIT electrode paste cannot use the glass body to penetrate to form an ohmic contact, and can only use organic adhesives to increase the adhesion. In order to meet the tensile requirements of the components, a certain amount of organic adhesion is added to the HIT paste. agent. However, because e...

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Problems solved by technology

But because excessive binder will lead to poor current collection ability and high contact resistance, the content of organic binder in conventional HIT paste is relatively low, and the pulling force of HIT battery is 30%-50% lower than that of conventional battery

Moreover, due to t

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