Manufacturing method of resistor, manufacturing method of chip resistor and chip resistor

Abstract

The invention discloses a manufacturing method of a resistor. The manufacturing method comprises the following steps: obtaining a first printing design size of a target resistor, and increasing the cross section area of the first printing design size according to a preset ratio, so as to obtain a second printing design size, wherein the first printing design size is designed according to the target resistance of the target resistor; according to the second printing design size, printing the resistor, so as to obtain a printed resistor; reducing the cross section area of the printed resistor bya resistance modifying technology, so as to enable the printed resistor to reach the target resistance, thereby obtaining the final resistor. The manufacturing method provided by the invention has the advantage that the power and pulse surge properties of the resistor are greatly improved.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a method for manufacturing a resistor, a method for manufacturing a chip resistor and the chip resistor. Background technique [0002] see figure 1 , Chip resistors are generally composed of ceramic substrate 1, back electrode 2, front electrode 3, resistor body 4, inner layer protection (primary protection layer) 5, outer layer protection (secondary protection layer) 6, terminal electrode 7, middle electrode 8 and external electrode 9. [0003] The manufacturing process of chip resistors mainly includes: screen production, printed back electrode, printed front electrode, printed resistor body, printed primary protection, laser trimming, printed secondary protection, primary division, terminal production, secondary division and electroplating these processes. Among them, the resist paste used for printing resistors contains solvents, which will volatilize after drying and ...

AI Technical Summary

Problems solved by technology

Among them, the resist paste used for printing resistors contains solvents, which will volatilize after drying and sintering, and the influence of printing flatness, which finally leads to the resistance value after sintering can only be within a certain range, and it is difficult to ensure that it can be directly achieved. The target resistance value, in order to improve the qualified rate, needs to be repaired to achieve it; usually, laser trimming is used to repair the resistor body at the cost of breaking down the internal structure of the resistor body to ensure that the target resistance value is reached, see figure 2 , there are cutting grooves in the internal structure of the resistor body after repairing resistance; among them, figure 2 Part (A) marks the width dimension a of the repair resistor, and the change of the width dimension a of the resistor repair is generally within 1 / 2 of the width of the resistor body; the circle marks the obvious weakness of the power of the resistor body and the anti-pulse surge performance deficiencies, figure 2 Part (B) is a schematic diagram of the current flowing through the resistor body. The current overload position is concentrated on the resistor body at the repair point, so the power and anti-pulse surge performance of the resistor body are limited. figure 2 Weaknesses shown in (A)

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