Temperature sensor encapsulation structure

A technology of temperature sensor and packaging structure, used in thermometers, thermometer parts, instruments, etc., can solve the problem that temperature sensors cannot meet high sealing, and achieve good mechanical collision resistance, good insulation sealing, high sealing requirements. Effect

Inactive Publication Date: 2018-05-29
四川泛华航空仪表电器有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a temperature sensor with high sealing performance, high vibration resistance and strong anti-interference ability to solve the problem that the temperature sensor of the existing packaging technology cannot meet the conditions of high sealing, high vibration intensity and harsh electromagnetic environment. Temperature sensor package structure

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  • Temperature sensor encapsulation structure

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Embodiment Construction

[0019] In order to further illustrate the principle and structure of the patent of the present invention, the embodiments of the present invention will now be described in detail in conjunction with the accompanying drawings.

[0020] Such as figure 1 As shown, a temperature sensor packaging structure of the present invention includes a housing 4 with one end closed, and the other end of the housing 4 is fixedly connected to a sealed socket 8, and is characterized in that: it also includes a housing packaged in the housing 4 and placed The heat-sensitive element 2 at the closed end, the heat-sensitive element 2 is filled with a heat-conducting medium to form a sensor temperature measuring probe 11, the heat-sensitive element 2 is connected to the sealed socket 8 through a transitional wire, and the airtight connection with the sensor temperature measuring probe 11 The cavity is filled with epoxy 5 to form a thermal conduction channel through which the excessive wires pass.

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Abstract

The invention discloses a temperature sensor encapsulation structure. The temperature sensor encapsulation structure comprises a shell (4) of which one end is closed. The other end of the shell (4) isfixedly connected with a sealed socket (8). The temperature sensor encapsulation structure is characterized in that the temperature sensor encapsulation structure also comprises a thermosensitive element (2) which is encapsulated inside the shell (4) and is located at the closed end; space around the thermosensitive element (2) is filled with a heat conduction medium, so that a sensor temperaturemeasuring probe (11) can be formed; the thermosensitive element (2) is connected with the sealed socket (8) through a transition wire; a sealed cavity communicated with the sensor temperature measuring probe (11) is filled with epoxy resin (5), so that a heat conducting passage through which the transition wire passes can be formed; a rubber sealing gasket (7) for sealing is arranged between thesealed socket (8) and the installation surface of the other end of the shell (4); and therefore, dual-sealing of the sealed socket (8) can be realized through the potting of the epoxy resin and the rubber sealing gasket, and high sealing performance, resistance to high-vibration environments and strong anti-interference capacity requirements are ensured.

Description

technical field [0001] The invention relates to a temperature sensor packaging structure, in particular to a temperature sensor packaging structure suitable for on-site temperature measurement in harsh environments. Background technique [0002] The temperature sensor is formed by encapsulating the heat sensitive element and cable inside the housing. A temperature transducer is a sensor that can sense the measured temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. According to the measurement method, it can be divided into two categories: contact type and non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. In the prior art, a MEMS temperature sensor is usually carried on a MEMS (Microelectro Mechanical Systems microelectromechanical system) sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/08
CPCG01K1/08
Inventor 田飞越刘培武刘鸿
Owner 四川泛华航空仪表电器有限公司
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