Temperature sensor encapsulation structure

Abstract

The invention discloses a temperature sensor encapsulation structure. The temperature sensor encapsulation structure comprises a shell (4) of which one end is closed. The other end of the shell (4) isfixedly connected with a sealed socket (8). The temperature sensor encapsulation structure is characterized in that the temperature sensor encapsulation structure also comprises a thermosensitive element (2) which is encapsulated inside the shell (4) and is located at the closed end; space around the thermosensitive element (2) is filled with a heat conduction medium, so that a sensor temperaturemeasuring probe (11) can be formed; the thermosensitive element (2) is connected with the sealed socket (8) through a transition wire; a sealed cavity communicated with the sensor temperature measuring probe (11) is filled with epoxy resin (5), so that a heat conducting passage through which the transition wire passes can be formed; a rubber sealing gasket (7) for sealing is arranged between thesealed socket (8) and the installation surface of the other end of the shell (4); and therefore, dual-sealing of the sealed socket (8) can be realized through the potting of the epoxy resin and the rubber sealing gasket, and high sealing performance, resistance to high-vibration environments and strong anti-interference capacity requirements are ensured.

Description

technical field [0001] The invention relates to a temperature sensor packaging structure, in particular to a temperature sensor packaging structure suitable for on-site temperature measurement in harsh environments. Background technique [0002] The temperature sensor is formed by encapsulating the heat sensitive element and cable inside the housing. A temperature transducer is a sensor that can sense the measured temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. According to the measurement method, it can be divided into two categories: contact type and non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. In the prior art, a MEMS temperature sensor is usually carried on a MEMS (Microelectro Mechanical Systems microelectromechanical system) sub...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a temperature sensor with high sealing performance, high vibration resistance and strong anti-interference ability to solve the problem that the temperature sensor of the existing packaging technology cannot meet the conditions of high sealing, high vibration intensity and harsh electromagnetic environment. Temperature sensor package structure

Images