Solder ball separation device for laser soldering

Abstract

The invention discloses a solder ball separation device for laser soldering. The solder ball separation device comprises a solder ball container, a solder ball separation component and a solder ball retaining mechanism. The bottom of the solder ball container is provided with an opening for releasing solder balls; the solder ball separation component comprises a ball separation magnetic plate anda rotating component, the rotating component is connected with the ball separation magnetic plate and used for driving the ball separation magnetic plate to rotate, the ball separation magnetic plateis peripherally provided with a plurality of separation holes at intervals, and the opening for releasing the solder balls is positioned above the separation holes; the solder ball retaining mechanismis connected with the separation holes through solder ball guide pipes. Positive and negative ions generated by an ionization device are brought into the separation holes by a fan, and consequently static electricity of the solder balls can be eliminated while the solder balls are enabled to quickly fall at an appointed position.

Description

Technical field [0001] The invention belongs to the technical field of laser welding, and particularly relates to a tin ball separation device for laser soldering. Background technique [0002] At present, soldering is very popular in industrial production, mainly using manual soldering iron soldering. Operators need to master the heating time. The bonding layer of the solder joints exceeds the appropriate thickness due to long-term heating, which causes the performance of the solder joints to deteriorate. , Plastics and other materials will be deformed and deteriorated if heated too much, and the performance of components will change or even fail after heating. The surface of the solder joints will be oxidized due to the volatilization of the flux and loss of protection. It is also necessary to maintain a suitable temperature. If you use a high-temperature soldering iron to shorten the heating time, Soldering joints will bring another problem: the flux in the solder wire does no...

AI Technical Summary

Problems solved by technology

[0002] At present, tin soldering is very popular in industrial production. Manual soldering iron welding is mainly used. Operators need to master the heating time. Due to long-term heating, the bonding layer of the solder joint exceeds the appropriate thickness, causing the performance of the solder joint to deteriorate. Printed boards , plastics and other materials will be deformed and deteriorated if they are heated too much, and the performance of components will change or even fail after being heated. Solder joints will bring another problem: the flux in the solder wire does not have enough time to flow on the surface to be welded and prematurely volatilize and fail; the melting speed of the solder is too fast to affect the function of the flux; due to the high temperature Although the heating time is short, it will also cause overheating; the soldering iron tip may also exert force on the solder joint, which will cause damage to the weldment or even fail, and the amount of solder needs to be manually controlled

[0003] Today's electronic products are becoming more and more sophisticated, the process is becoming more and more complicated, and the solder joints are getting smaller and smaller, so the solder used is also getting smaller and smaller. At present, the solder balls used in many precision soldering are as small as 50um. The electrostatic adsorption generated by process friction cannot fall in the container, which will lead to no tin balls in the tin spray port, and poor solder joints due to empty soldering. The probability of this happening is extremely high

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