Forming process of stainless steel hemispherical end socket

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below.

[0021] The forming process of a stainless steel hemispherical head provided by the invention comprises the following steps:

[0022] 1) Cut the circle: cut by the plasma cutting machine according to the specified blanking;

[0023] 2) Stamping: Stamping is carried out by a 2000-ton stamping machine equipped with a PHH1100R1100-8AB1100 die;

[0024] 3) Welding tooling: tooling for welding solid solution;

[0025] 4) Solid solution: heat treatment according to the solid solution temperature of stainless steel;

[0026] 5) Unloading tooling: remove the solid solution tooling;

[0027] 6) Pre-bevel: place the head on the bevel rotating platform, and use the MAX250 plasma torch to remove the bevel when unloading the tool;

[0028] 7) Pre-pickling: remove oxides produced on the surface of the head during heat treatment;

[0029] 8) Stamping and forming again, and stamping by a 2000-ton stamping machine equipped with a PHH1100R1100-8AB1100 die;

[0030] 9) Bevel: put the head on the bevel rotating platform, use the MAX250 plasma torch to bevel according to the required bevel type, and check the size;

[0031] 10) Pickling: passivation;

[0032] 11) Check;

[0033] 12) Warehousing.

[0034] The molding process of the stainless steel hemispherical head disclosed by the invention improves the internal quality of the product, improves the material structure of the head, reduces the internal stress of the product, reduces the risk of the use environment, and makes the product more durable; The bulging and cracking produced during the forming process; a larger size head can also be made with a smaller size press.

[0035] The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.