An Insulated Gate Bipolar Transistor
A technology of bipolar transistors and transistors, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the conduction voltage drop and the withstand voltage of insulated gate bipolar transistors, so as to reduce the conduction voltage drop and improve various The effect of the item parameter capability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0020] An insulated gate bipolar transistor provided in the embodiment of the present application, the insulated gate bipolar transistor (Insulate-GateBipolar Transistor-IGBT) referred to as IGBT, combines the functions of a power transistor (Giant Transistor-GTR) and a power field effect transistor (Power MOSFET) Advantages, with good characteristics, a wide range of applications; IGBT is also a three-terminal device: gate, collector and emitter. IGBT is a bipolar device with MOS structure, which belongs to the power device with high-speed performance of power MOSFET and low resistance performance of bipolar. The application range of IGBT is generally in the area with a withstand voltage of 600V or more, a current of 10A or more, and a frequency of 1kHz or more. It is mostly used in industrial motors, civilian small-capacity motors, converters (inverters), camera strobes, induction heating (Induction Heating) rice cookers and other fields. Such as figure 1 shown, the transi...
Embodiment 2
[0035] In order to describe an IGBT more clearly, the embodiment of the present application also provides a working principle of the IGBT, and the working principle of the IGBT will be described in detail below.
[0036] When the insulated gate bipolar transistor described in this application is in the conduction state, since the gate of the non-circular cell region is locally narrowed and designed to connect the N+ emitter 1 to the metal ground, the P injection layer 5 can realize a ground bias connection structure, At this time, due to the effect of the ground potential, the two adjacent P injection layers 5 in the device circular cell structure can easily achieve mutual depletion at a relatively low concentration, forming a shielding structure effect, so at this time the transistor design can select the polarity The high-concentration N-type carrier storage layer 4 is designed, and the selected concentration can be higher than the concentration of the N-type storage layer se...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
