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Laser machining system and laser machining method for chamfering glass screen body

A laser processing and glass screen technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of low processing efficiency, unfavorable screen strength performance, burning traces of cutting tracks, etc., to improve cutting efficiency and processing. The process is clean and environmentally friendly, and the cutting section is flat and no taper.

Pending Publication Date: 2018-06-08
SUZHOU DELPHI LASER +1
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] The traditional processing methods mainly include CNC grinding wheel grinding and laser vibrating mirror ablation. The former processing method has low processing efficiency and requires continuous water spray during the grinding process. The glass powder produced during the process is mixed with water to pollute the screen; the latter Processing scheme, there is serious heat accumulation in the processing process, there are obvious burning marks in the cutting line, and there is a certain cutting taper, which is not conducive to the strength performance of the entire screen

Method used

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  • Laser machining system and laser machining method for chamfering glass screen body

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Embodiment Construction

[0022] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific implementations are now described in detail.

[0023] Such as figure 1 As shown, the laser processing system for glass screen chamfering includes a picosecond laser 1, a beam expander 2 and a laser cutting head 6. The picosecond laser 1 is an infrared picosecond laser, and the output end of the optical path of the picosecond laser 1 is arranged with a The beam mirror 2 and the output light path of the beam expander 2 are provided with a reflector, and a laser cutting head 6 is arranged on the reflective light path of the reflector. The laser cutting head 6 is provided with a beam shaping unit for focusing the laser light into a bundle of filaments. The output end of the optical path of the cutting head 6 is facing the moving platform for carrying the glass screen body 8 , and a CCD alignment system 7 is arranged above the moving platform 9 .

[00...

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Abstract

The invention relates to a laser machining system and a laser machining method for chamfering a glass screen body. A beam expander is arranged at an optical path output end of a picosecond laser; a reflecting mirror is arranged on an output optical path of the beam expander; a laser cutting head is arranged on a reflecting optical path of the reflecting mirror; the optical path output end of the laser cutting head directly faces to a moving platform which is used for bearing the glass screen body; and a CCD alignment system is arranged above the moving platform. According to the laser machining method, the picosecond laser is used for emitting laser; the beam expander is used for collimating the laser and expanding the laser beams so as to improve the collimation degree of the laser and increase the diameter of the emitted laser beams; the reflecting mirror is used for reflecting the laser beams into the laser cutting head and focusing the laser into a beam of laser filament; the laserfilament is focused to the glass screen body on the moving platform; and the CCD alignment system and the moving platform cooperate to realize penetration type scribing at a specified position of theglass screen body. The laser machining system and the laser machining method provided by the invention are suitable for rapidly and efficiently cutting the glass screen body; glass can be penetratedat a time by virtue of a suitable filament length structure; the glass can be cut into pieces after being cut once; and a cut section is smooth and free of taper.

Description

technical field [0001] The invention relates to a laser processing system and method for chamfering a glass screen body and belongs to the technical field of laser processing. Background technique [0002] At present, with the popularization of the "full screen" concept of mobile phones, panel factories or related module factories are required to chamfer the four corners of the mobile phone display. [0003] The traditional processing methods mainly include CNC grinding wheel grinding and laser vibrating mirror ablation. The former processing method has low processing efficiency and requires continuous water spray during the grinding process. The glass powder produced during the process is mixed with water to pollute the screen; the latter Processing scheme, there is serious heat accumulation in the processing process, there are obvious burning marks in the cutting line, and there is a certain cutting taper, which is not conducive to the strength performance of the entire sc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/064B23K26/067B23K26/0622
CPCB23K26/0624B23K26/0643B23K26/067B23K26/38
Inventor 赵裕兴田超
Owner SUZHOU DELPHI LASER
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