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Process for forming solderable polyimide-based polymer thick film conductor

A polyimide and polymer technology, applied in the field of polyimide-based polymer thick film conductors, can solve the problems of non-solder wetting, non-substrate adhesion, etc.

Inactive Publication Date: 2018-06-08
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, many current PTF electrode compositions do not wet well with solder and do not have good adhesion to the substrate after soldering

Method used

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  • Process for forming solderable polyimide-based polymer thick film conductor
  • Process for forming solderable polyimide-based polymer thick film conductor
  • Process for forming solderable polyimide-based polymer thick film conductor

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0076] Screen printable Ag compositions were prepared using silver flakes with an average particle size of 3-4 microns. The components of the PTF silver conductor composition are:

[0077]

[0078]

[0079] Where wt% is based on the total weight of the composition. The ratio of the weight of silver to the weight of polyimide is 24.7

[0080] The components were combined and mixed in a Thinky type mixer for 30-60 seconds and then roll milled. This composition is used in Screen printing on 500HPP-ST film figure 1 The 600 square serpentine pattern illustrated in . Using a 325-mesh stainless steel screen, several patterns were printed, and the silver paste was dried at 130° C. for 10 min. The measured line resistance from the sample was 7.7Ω. The average conductor thickness over a 600 square pattern was determined to be 12.7 μm using a profiler. Therefore, the resistivity was calculated to be 6.5 mΩ / □ / mil. Some of the samples cured at 130°C for 10 min were cured aga...

example 2

[0084] Screen printable Ag compositions were prepared using silver flakes with an average particle size of 3-4 microns. The components of the PTF silver conductor composition are:

[0085]

[0086] Where wt% is based on the total weight of the composition. The ratio of the weight of silver to the weight of polyimide was 19.9.

[0087] The components were combined and mixed in a Thinky type mixer for 30-60 seconds and then roll milled. This composition is used in Screen printing on 500HPP-ST film figure 1 The 600 square serpentine pattern illustrated in . Using a 325-mesh stainless steel screen, several patterns were printed, and the silver paste was dried at 130° C. for 10 min. The measured line resistance from the sample was 6.7Ω. The average conductor thickness over a 600 square pattern was determined to be 13.8 μm using a profiler. Therefore, the resistivity was calculated to be 6.3 mΩ / □ / mil. Some of the samples cured at 130°C for 10 min were cured again at 260°...

example 3

[0093] Screen printable Ag compositions were prepared using silver flakes with an average particle size of 3-4 microns. The components of the PTF silver conductor composition are:

[0094] 82.9wt% silver powder

[0095] 2.5wt% Polyimide #1

[0096] 14.6wt% triethyl phosphate

[0097] Where wt% is based on the total weight of the composition. The ratio of the weight of silver to the weight of polyimide was 33.2.

[0098] The components were combined and mixed in a Thinky type mixer for 30-60 seconds and then roll milled. This composition is used in 500HPP-ST, 200RS100 and screen printing on alumina substrates figure 1 The 600 square serpentine pattern illustrated in . Using a 325-mesh stainless steel screen, several patterns were printed, and the silver paste was dried at 130° C. for 10 min. measured from the The line resistances of samples on 500HPP-ST, Kapton 200RS100 and alumina substrates were 10.1, 5.1 and 9Ω, respectively. The average conductor thickness ove...

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Abstract

The invention is directed to a process for forming a solderable polyimide-based polymer thick film conductor in which a paste composition comprising an electrically conductive metal, a polyimide and an organic solvent is cured by heating at a temperature of 280 to 320 DEG C. The invention is also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed by the process of the invention.

Description

technical field [0001] The present invention is directed to a method for forming solderable polyimide-based polymer thick film (PTF) conductors. Background technique [0002] Generally, thick film compositions include a functional phase that imparts suitable electrical functional properties to the composition. The functional phase comprises an electrofunctional powder dispersed in an organic solvent containing a polymer. These compositions will typically contain a binder, such as glass frit. Such compositions are fired to burn out the polymer and solvent and to impart electrically functional properties. However, in the case of polymer thick films, the polymer remains as an integral part of the composition after drying and only the solvent is removed. Processing requirements may include heat treatment, such as curing as known to those skilled in the art of polymer thick film technology. [0003] Many PTF compositions are only stable up to about 200°C and therefore they ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
CPCH01B1/22C09D11/03C09D11/102C09D11/52H05K1/095H05K2201/0154H05K2201/0245C08K3/08C08K2003/0806C09D5/24C09D179/08
Inventor 徐世起
Owner EI DU PONT DE NEMOURS & CO