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A kind of high-speed vcp copper plating additive and preparation method thereof

An additive and high-speed technology, applied in the field of high-speed VCP copper plating additives and its preparation, can solve the problems of poor plating uniformity, maximizing current density, and affecting productivity in the gantry line plating process, and achieve shortened plating time, excellent uniformity, and uniformity. good effect

Active Publication Date: 2019-07-09
深圳市星扬高新科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Printed circuit board hole metallization technology is one of the keys to printed circuit board manufacturing technology. For a long time, people have been using the traditional gantry line electroplating technology, but the gantry line electroplating process has poor plating uniformity and low efficiency, which has become increasingly It is not applicable to the development trend of industry technology; therefore, the industry has been looking for new technologies, and high-speed VCP electroplating technology (ie: a full-board copper plating production technology using a spray copper plating process and a vertical continuous conveying device) is here Compared with the gantry wire electroplating process, its process flow is simple, the current density is high, the efficiency is high, and the electroplating uniformity is good; however, due to the lack of high-performance copper plating additives, the high-speed VCP electroplating process It is still impossible to maximize the current density during processing, which affects the production capacity to a certain extent. If the existing copper plating additives are used and the current density is rigidly increased, it is easy to reduce the ductility and uniformity of copper plating on the circuit board. sex

Method used

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  • A kind of high-speed vcp copper plating additive and preparation method thereof
  • A kind of high-speed vcp copper plating additive and preparation method thereof
  • A kind of high-speed vcp copper plating additive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] S1. Mix and stir 3 kg of water-soluble polyethylene glycol with a molecular weight of 10000-20000 and 43 kg of water until the polyethylene glycol is completely dissolved to obtain a primary mixture;

[0024] S2. Add 0.1kg of 2-picolinic acid into the primary mixture and mix and stir until the 2-picolinic acid is completely dissolved to obtain the secondary mixture;

[0025] S3, adding 10 kg of polyethylene glycol to polypropylene glycol in the ratio of 3:1 polyethylene glycol polypropylene glycol copolymer to the secondary mixture for mixing and stirring until the polyethylene glycol polypropylene glycol copolymer is completely dissolved to obtain a third mixture ;

[0026] S4. Add 0.2kg of quaternized polyvinylimidazole into the three mixtures and mix and stir until the polyvinylimidazole is completely dissolved to obtain the four mixtures;

[0027] S5. Add 0.4kg sodium dimethylformamidopropane sulfonate to the mixture for four times and mix and stir until the sodium...

Embodiment 2

[0030] S1. Mix and stir 5 kg of water-soluble polyethylene glycol with a molecular weight of 10000-20000 and 46 kg of water until the polyethylene glycol is completely dissolved to obtain a primary mixture;

[0031] S2. Add 0.3kg of 2-picolinic acid into the primary mixture and mix and stir until the 2-picolinic acid is completely dissolved to obtain the secondary mixture;

[0032] S3. Add 5 kg of polyethylene glycol-polypropylene glycol copolymer with a ratio of 3:1 to polypropylene glycol to the secondary mixture and mix and stir until the polyethylene glycol-polypropylene glycol copolymer is completely dissolved to obtain a tertiary mixture ;

[0033] S4. Add 0.3kg of quaternized polyvinylimidazole into the three mixtures and mix and stir until the polyvinylimidazole is completely dissolved to obtain the four mixtures;

[0034] S5. Add 0.6kg sodium dimethylformamidopropane sulfonate into the mixture for four times and mix and stir until the sodium dimethylformamidopropane ...

Embodiment 3

[0037] S1. Mix and stir 2 kg of water-soluble polyethylene glycol with a molecular weight of 10000-20000 and 37 kg of water until the polyethylene glycol is completely dissolved to obtain a primary mixture;

[0038] S2. Add 0.1kg of 2-picolinic acid into the primary mixture and mix and stir until the 2-picolinic acid is completely dissolved to obtain the secondary mixture;

[0039] S3. Add 8 kg of polyethylene glycol-polypropylene glycol copolymer with a ratio of 3:1 to polypropylene glycol to the secondary mixture and mix and stir until the polyethylene glycol-polypropylene glycol copolymer is completely dissolved to obtain a three-time mixture ;

[0040] S4. Add 0.1kg of quaternized polyvinylimidazole to the three mixtures and mix and stir until the polyvinylimidazole is completely dissolved to obtain the four mixtures;

[0041] S5. Add 0.2kg sodium dimethylformamidopropane sulfonate to the mixture for four times and mix and stir until the sodium dimethylformamidopropane su...

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Abstract

The invention relates to the technical field of circuit board metallization treatment, in particular to a high-speed VCP copper plating additive and a preparing method thereof. The additive comprisesfollowing components including, by weight, 5-10 parts of polyethylene glycol polypropylene glycol copolymer, 0.2-0.6 part of TPS, 0.1-0.3 part of poly(vinyl imidazole), 0.1-0.3 part of 2-picolinic acid, 2-5 parts of polyethylene glycol and 74-92 parts of water. According to the high-speed VCP copper plating additive and the preparing method thereof, on the premise that excellent ductility and uniformity of plated copper are guaranteed, 5-7ADS current density can be used, and accordingly conditions are provided for improving the circuit board copper plating productivity.

Description

technical field [0001] The invention relates to the technical field of circuit board metallization treatment, in particular to a high-speed VCP copper plating additive and a preparation method thereof. Background technique [0002] Printed circuit board hole metallization technology is one of the keys to printed circuit board manufacturing technology. For a long time, people have been using the traditional gantry line electroplating technology, but the gantry line electroplating process has poor plating uniformity and low efficiency, which has become increasingly It is not applicable to the development trend of industry technology; therefore, the industry has been looking for new technologies, and high-speed VCP electroplating technology (ie: a full-board copper plating production technology using a spray copper plating process and a vertical continuous conveying device) is here Compared with the gantry wire electroplating process, its process flow is simple, the current den...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D5/08
CPCC25D3/38C25D5/08
Inventor 王荣茹李亚全周国新童勇灯
Owner 深圳市星扬高新科技有限公司
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