PCB (printed circuit board) isolation graph secondary dry film etching method

An etching and isolation technology, which is applied in the field of secondary dry film etching of PCB isolated patterns, can solve the problems of inconsistency in current density, uneven pattern distribution, etching pattern uniformity, and difficulty in pattern tolerance, so as to improve product yield and guarantee The effect of product quality requirements

Inactive Publication Date: 2018-06-22
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the uneven distribution of patterns, it is difficult to have consistent current densities in different areas during pattern electroplating, and it is difficult to control the uniformity of etching patterns and pattern tolerances, and even lead to poor quality such as sandwiches, small holes, and horn holes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for secondary dry film etching of PCB isolated figures, comprising the steps of:

[0022] a. Graphic transfer;

[0023] b. Graphic plating;

[0024] c. Graphic etching;

[0025] d. The second graphics transfer;

[0026] e. Second etching;

[0027] Wherein, the c step includes alkaline etching, and the non-isolated pattern area is completely etched without leaving copper residue;

[0028] The step d includes the following steps: sticking a layer of dry film: the thickness of the dry film is 30um; the first press molding: the pressing speed is 2.0±0.5m / min, the pressing temperature is 110±5°C; sticking a layer of dry film: The dry film thickness is 30um; the second pressing mold: the pressing film speed is 1.8±0.5m / min, the pressing film temperature is 100±5°C; exposure: the single-side compensation of 1.2mil for the window opening of the isolated pattern (opening the window refers to the need for welding or heat dissipation The place where the copper foil i...

Embodiment 2

[0032] A method for secondary dry film etching of PCB isolated figures, comprising the steps of:

[0033] a. Graphic transfer;

[0034] b. Graphic plating;

[0035] c. Graphic etching;

[0036] d. The second graphics transfer;

[0037] e. Second etching;

[0038] Wherein, the c step includes alkaline etching, and the non-isolated pattern area is completely etched without leaving copper residue;

[0039] The step d includes the following steps: sticking a layer of dry film: the thickness of the dry film is 35um; pressing the mold for the first time: pressing the film at a speed of 2.0±0.5m / min, and the temperature of the pressing film is 110±5°C; sticking a layer of dry film: The dry film thickness is 25um; the second pressing mold: the pressing film speed is 1.8±0.5m / min, the pressing film temperature is 100±5°C; The place where the copper foil is exposed on the green oil layer or the solder mask layer), no window is opened in the non-isolated graphic area, the exposure r...

Embodiment 3

[0043] A method for secondary dry film etching of PCB isolated figures, comprising the steps of:

[0044] a. Graphic transfer;

[0045] b. Graphic plating;

[0046] c. Graphic etching;

[0047] d. The second graphics transfer;

[0048] e. Second etching;

[0049] Wherein, the c step includes alkaline etching, and the non-isolated pattern area is completely etched without leaving copper residue;

[0050] The step d includes the following steps: attaching a layer of dry film: the thickness of the dry film is 31um; the first compression molding: the pressing speed is 2.0±0.5m / min, and the pressing temperature is 110±5°C; attaching a layer of dry film: The dry film thickness is 30um; the second stamping: lamination speed 1.8±0.5m / min, lamination temperature 100±5°C; exposure: single side compensation of 1.5mil for isolated graphics window opening (window opening refers to the need for welding or heat dissipation The place where the copper foil is exposed outside the green oil...

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PUM

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Abstract

The invention relates to the technical field of PCB (printed circuit board) processing, and discloses a PCB isolation graph secondary dry film etching method which includes the steps: a graph transfer; b graph electroplating; c graph etching; d secondary graph transfer; e secondary etching. The method is applicable to secondary dry film etching of PCBs with locally isolated graphs and the copper thickness of 2OZ-3OZ, production defect rate is greatly reduced, and the method is low in cost, high in efficiency and suitable for large-scale popularization.

Description

technical field [0001] The invention relates to the technical field of PCB processing, in particular to a method for secondary dry film etching of PCB isolated patterns. Background technique [0002] With the development of functional diversity of electronic products, more and more performances are carried by PCB, such as RF line design on PCB, local plug-in signal transmission, local high voltage design, etc. This type of design requires partial or entire graphic isolation of PCB (Isolated graphics design refers to the layout of double lines, double pads, double holes or other special-shaped graphics in the open area, and there is not enough space between the graphics to ensure compensation). Due to the uneven distribution of patterns, it is difficult to have consistent current densities in different areas during pattern plating, and it is difficult to control the uniformity of etching patterns and pattern tolerances, and even lead to poor quality such as film sandwiching, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
Inventor 付雷黄勇贺波
Owner 奥士康精密电路(惠州)有限公司
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